Die Bonding Control with Predistortion for Accurate Alignment
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Solution Overview
Problem
Conventional bonding methods that involve bending a die to improve bonding reliability result in shape errors and decreased accuracy due to bonding distortion between the die and the substrate.
Innovation Solution
A bonding apparatus and method that control the bonding operation to achieve a predetermined distortion shape by adjusting the bonding control conditions based on die information, using a driving unit and control unit to manipulate the die into a convex shape during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the die is bent into a downward convex shape for bonding, then bonding reliability is improved, but shape error occurs in the die and bonding accuracy decreases
Solution Approach 1:
The die is pre-bent into a predetermined distortion shape before bonding. By performing this preliminary shaping action, the die is prepared in advance to compensate for bonding distortion, allowing it to achieve the desired flat shape after bonding without compromising accuracy
Solution Approach 2:
The die is pre-distorted in the opposite direction of the expected bonding distortion. This preliminary anti-action counteracts the distortion that will occur during bonding, ensuring that the final bonded shape matches the target shape with high precision
2Reliability
If the die is bent to improve bonding reliability, then bonding reliability is enhanced, but positional deviation between die and substrate increases
Solution Approach 1:
The die is pre-bent into a specific distortion shape before the bonding process. This preliminary action ensures that when bonding occurs, the die and substrate align accurately at their bonding surfaces, minimizing positional deviation while maintaining bonding reliability
Solution Approach 2:
The shape parameters of the die are changed by pre-bending it into a predetermined distortion shape. This parameter change compensates for the distortion that will occur during bonding, ensuring accurate positioning and alignment between the die and substrate
Data Source
AI summary
A bonding apparatus that performs a bonding operation of bonding a bonding object to a bonding target object, including a driving unit configured to perform driving such that the bonding object is bonded to the bonding target object, and a control unit configured to control the bonding operation such that a bonded shape of the bonding object after the bonding object is bonded to the bonding target object achieves a predetermined distortion shape.