IC Die Delayering Pocket Structure for Planar Edge Preservation
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Solution Overview
Problem
The challenge in integrated circuit delayering is maintaining the planarity of the die surface while removing layers, as existing methods often result in rounding of the edges, which is difficult due to the small size of the die.
Innovation Solution
Creating a pocket in a sacrificial material that conforms to the die shape, using an adhesive substance like wax to secure the die within the pocket, and removing layers without affecting the die's edges by directing any negative effects to the sacrificial material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mechanical or chemical delayering methods are used on small integrated circuit die, then layers can be removed from the die, but the edges of the die become rounded and planarity is lost
Solution Approach 1:
A pocket structure is introduced as an intermediary element between the delayering process and the die. The pocket has walls that physically constrain the die during mechanical or chemical delayering, preventing edge rounding while allowing layer removal. This mediator structure enables the use of effective delayering methods without their harmful side effects.
Solution Approach 2:
The pocket structure is prepared in advance with dimensions and wall positions that pre-emptively counteract the edge rounding tendency of delayering processes. By establishing physical boundaries before delayering begins, the system prevents the harmful effect rather than correcting it afterward.
2Volume of moving object
If the die is small in size, then integrated circuit functionality is maintained, but maintaining planarity during delayering becomes extremely difficult
Solution Approach 1:
The pocket structure provides localized support and constraint specifically at the die edges and surfaces that need protection. The pocket walls are positioned to provide just enough mechanical support to maintain planarity during delayering, applying quality control locally where needed rather than requiring uniform treatment of the entire small die structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively maintains the planarity of the die surface during delayering by preventing edge rounding and ensuring the sacrificial material absorbs any negative effects, thus preserving the die's shape and functionality.
Implementation Method 1
An adhesive substance may be positioned in the pocket. The die may be inserted into the pocket and against the adhesive substance, wherein the adhesive substance adheres to a bottom of the die and aids in retaining the die in the pocket.
Implementation Method 2
The wax substance may initially be in an unsolidified state, and the method may further include maintaining the die in a desired position and orientation within the pocket until the wax substance cools to a solidified state.
Data Source
AI summary
An apparatus and method for facilitating the removal of layers from a die for an integrated circuit while maintaining the planarity of the surface of the die by avoiding rounding the corners and other edges of the die. A pocket is created in a sacrificial material, such that when the die is inserted into the pocket the edges of the die are contiguous with the walls of the pocket and a top surface of the die is coplanar with a top surface of the pocket. The sacrificial material may be the same material as the die. An adhesive substance is placed in the pocket, and the die is inserted into the pocket and against the adhesive substance which aids in retaining the die in the pocket. The layers may then be removed from the die and the sacrificial material around the die without rounding the edges of the die.