Die Level Cavity Heat Sink for Thermal Dissipation
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Solution Overview
Problem
Modern electronic systems packaging faces challenges in thermal dissipation due to increased performance and miniaturization, leading to localized heat buildup that exceeds traditional thermal dissipation capabilities, potentially causing performance degradation and premature failure.
Innovation Solution
The implementation of a die level cavity heat sink and selective heat sink elements within the package, along with thermal interface materials, to effectively direct and disperse heat generated by integrated circuits, utilizing both substrate and encapsulant layers for enhanced thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional package thermal dissipation techniques are used, then the package structure is simple, but the thermal dissipation capability is insufficient for high-performance electronic components
Solution Approach 1:
The patent segments the thermal management function by introducing separate heat sink structures at different levels: die-level cavity heat sinks for individual chips and package-level heat sinks for overall thermal control. This segmentation allows each component to address specific thermal challenges, improving overall thermal dissipation capability while maintaining modular package architecture.
Solution Approach 2:
The patent transitions from traditional two-dimensional heat dissipation surfaces to three-dimensional cavity structures. The die-level cavity heat sinks create vertical thermal pathways through the package, adding a third dimension to heat flow and significantly increasing the effective thermal dissipation surface area without expanding the package footprint.
2Volume of moving object
If the package size is reduced for miniaturization, then the form factor is smaller, but the thermal management capability is compromised
Solution Approach 1:
The patent implements nested heat sink structures where die-level cavity heat sinks are positioned within the package cavity, and package-level heat sinks are integrated into the existing package architecture. This nesting approach maximizes thermal management functionality within the constrained package volume, providing multi-level thermal control without increasing overall package size.
Solution Approach 2:
The patent applies local quality by positioning heat sink structures specifically at locations of highest thermal generation (die-level cavities under hot chips) and at package boundaries for heat extraction. This localized thermal management approach concentrates thermal control resources where most needed, maintaining effective thermal management in miniaturized packages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves thermal performance by up to 17% compared to current methods, maintaining high performance and extending the lifespan of electronic systems by efficiently dissipating heat away from critical components.
Implementation Method 1
the heat sink is operable to direct heat generated from the at least one die into the substrate
Implementation Method 2
a first thermal interface material layer between the heat sink and the substrate
Implementation Method 3
absorbing at least a portion of the heat generated by the at least one die with a heat sink defining a cavity containing the at least one die therein
Data Source
AI summary
A die level cavity heat sink that can be used within current and emerging packaging technologies to improve die level thermal performance within the package. Alternatively, or in addition, selective heat sink elements are provided to further manage thermal performance within a package by providing thermal pads from the interior of the package to a surface of a mold cap where additional thermal cooling mechanisms can be utilized to further remove heat from the package area.