Die Package Structure With Non-Shrinkage Layers for Void Control
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving compactness and reliability due to issues such as deformation and void formation in the redistribution layers and encapsulant materials, which affect the electrical connectivity and integrity of the package structure.
Innovation Solution
The use of non-shrinkage materials in the formation of protection and polymer layers, along with the integration of through integrated fan-out vias, ensures a stable and planar surface for the redistribution layers, reducing deformation and voids, and enhancing electrical connectivity between dies and connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional shrinkage materials are used in redistribution layers and encapsulant, then manufacturing process is simpler, but deformation and voids occur reducing reliability
Solution Approach 1:
The patent applies parameter changes by transitioning from conventional shrinkage materials to non-shrinkage materials (such as specific polymer compositions with controlled thermal expansion coefficients) in the redistribution layers and encapsulant. This material parameter change eliminates deformation and void formation during packaging processes, thereby improving reliability without significantly increasing process complexity
Solution Approach 2:
The patent employs composite materials by formulating encapsulant and protection layers using specific polymer compositions (e.g., epoxy-based materials with controlled filler content and thermal properties) that provide both structural stability and compatibility with semiconductor components. These composite materials resist shrinkage while maintaining adhesion and electrical insulation properties
2Area of stationary object
If compact package design is implemented, then area utilization improves, but surface roughness and deformation increase
Solution Approach 1:
The patent changes the thermal and mechanical parameters of the encapsulant material by using non-shrinkage formulations with controlled coefficients of thermal expansion (CTE) matched to the substrate and dies. This allows compact package design to be implemented while maintaining surface planarity and reducing deformation during reflow and curing processes
Solution Approach 2:
The patent applies beforehand cushioning by designing the encapsulant material with specific viscoelastic properties and damping characteristics that compensate for thermal stresses and shrinkage forces during packaging. The material acts as a cushioning layer that absorbs deformation energy and maintains surface flatness even in compact configurations
Data Source
AI summary
A die includes a substrate, a conductive pad, a connector a protection layer, and a passivation layer. The conductive pad is disposed over the substrate. The connector is disposed on the conductive pad. The connector comprises a seed layer and a conductive post on the seed layer. The protection layer laterally covers the connector. The passivation layer is disposed between the protection layer and the conductive pad. The conductive post is separated from the passivation layer and the protection layer by the seed layer.