Semiconductor Die Pad Trenches for Peeling Prevention
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Solution Overview
Problem
The peeling between the sealing body and the die pad or leads in semiconductor devices can lead to performance deterioration, as existing technologies fail to effectively prevent the growth of peeling, which can crack the die bonding material and affect the heat sink and electric properties.
Innovation Solution
The semiconductor device incorporates a die pad with strategically arranged trenches, such as the resin lock trench, and leads with shallow trenches, to increase contact area and prevent peeling growth, using a combination of pressing and laser irradiation to form these trenches, thereby enhancing the adhesion between the sealing body and the die pad and leads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If trenches are formed in the die pad to prevent peeling, then the adhesion between sealing body and die pad is improved, but the manufacturing complexity increases
Solution Approach 1:
The die pad is segmented into multiple portions (first portion with semiconductor chip, second portion without chip, third portion connecting them) with different trench configurations. Each portion has trenches strategically placed to address specific peeling risks in that region, creating a segmented defense against peeling rather than a uniform structure throughout.
Solution Approach 2:
Different regions of the die pad have different trench characteristics (depth, width, spacing) tailored to local requirements. The first portion has trenches optimized for chip adhesion, the second portion has trenches for edge sealing, and the third portion has trenches for connection stability. This local customization of trench quality addresses peeling prevention more effectively than a uniform structure.
2Reliability
If multiple trenches are arranged in the die pad to suppress peeling growth, then the reliability is improved, but the manufacturing precision requirements increase
Solution Approach 1:
Trenches are formed in the die pad before mounting the semiconductor chip and applying the sealing body. This preliminary structuring of the die pad with trenches already in place allows subsequent assembly steps to proceed without requiring high precision alignment, as the trenches are pre-positioned to provide peeling suppression from the start.
Solution Approach 2:
The trenches extend beyond the immediate chip mounting area into the second portion of the die pad that does not overlap with the chip. This excessive extension of trenches into non-critical areas provides additional peeling suppression margin and ensures that peeling is stopped even if it starts at the edges, compensating for potential manufacturing variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively suppresses peeling growth, preventing damage to the die bonding material and improving the heat sink and electrical properties of the semiconductor device, allowing for more reliable performance and manufacturing efficiency.
Implementation Method 1
using a combination of pressing and laser irradiation to form these trenches
Data Source
AI summary
An upper surface of a main portion of a die pad includes a first region overlapping a semiconductor chip, a second region arranged between a side and the first region, and a third region arranged between the first region and a connecting portion. In the upper surface of the main portion, each of a second trench length of a second trench arranged in the second region and a third trench length of a third trench arranged in the third region is larger than a first trench length of a first trench arranged in the connecting portion. Each of a second trench width of the second trench arranged in the second region and a third trench width of the third trench arranged in the third region is smaller than a first trench width of the first trench arranged in the connecting portion.