Adaptive Die Test Socket Sealing for High-Pressure Bare Die Testing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in semiconductor die testing is the high requirement for accuracy and sealing in testing bare dies due to their thinness and small contact regions, along with the need for ultra-high voltage and current in a high-pressure environment, which existing test sockets struggle to meet, leading to issues with flatness and potential sparking.
Innovation Solution
An adaptive die testing apparatus with a support frame and movable panel, featuring test sockets that form a sealed chamber and use high-pressure gas, along with a mechanism to ensure precise contact and sealing through springs and springs blocks, allowing for a floating state to adjust for deviations and maintain consistent contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional test sockets are used for bare die testing, then the testing process can be completed, but the flatness accuracy is insufficient and sparking may occur due to poor contact
Solution Approach 1:
The patent employs a spring-loaded mechanism that allows the test socket to dynamically adjust to the die surface. The spring force ensures continuous contact pressure compensation, enabling the socket to adapt to minor variations in die flatness while maintaining stable electrical contact throughout the testing process
Solution Approach 2:
The test socket is pre-loaded with spring force before actual testing begins. This preliminary mechanical pre-compression ensures that when the die is placed, optimal contact pressure is already established, preventing sparking and ensuring reliable electrical connection from the start of testing
2Power
If high voltage and current testing is performed in air, then testing can be conducted, but space discharge and pin ablation occur due to breakdown voltage limitations
Solution Approach 1:
The patent introduces an inert gas environment (such as nitrogen or sulfur hexafluoride) within the test chamber to replace air during high voltage testing. This inert atmosphere increases the breakdown voltage, preventing space discharge and电弧 formation, thereby eliminating sparking and pin ablation while enabling safe high power testing
3Ease of manufacture
If the test socket structure is simplified, then manufacturing is easier, but sealing performance deteriorates under high pressure
Solution Approach 1:
The patent utilizes flexible sealing elements such as elastomeric O-rings or deformable sealing lips that can conform to the test chamber surfaces. These flexible components maintain effective sealing under high pressure conditions while allowing for simpler overall socket structure design, as they compensate for minor manufacturing tolerances through elastic deformation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances sealing and pressure resistance, ensuring consistent contact resistance and improving test data consistency while protecting dies from sparking and pin ablation in high-pressure environments.
Implementation Method 1
another side of the strip-shaped block extends to directly above the second protruding strip and is connected to the second protruding strip through at least two springs
Implementation Method 2
A maximum breakdown voltage is increased by increasing air pressure around the die, thereby avoiding space discharge between pins
Data Source
AI summary
The present disclosure provides an adaptive die testing apparatus and a formation method. The adaptive die testing apparatus includes a support frame capable of moving along a vertical direction; a movable panel capable of moving along a horizontal direction; an upper test socket installed on the support frame; and a lower test socket installed on the movable panel and capable of moving with the movable plate to directly below the upper test socket. A groove is formed on a lower surface of the upper test socket and/or an upper surface of the lower test socket. When the adaptive die testing apparatus is at a testing state, the lower surface of the upper test socket is in a close contact with the upper surface of the lower test socket, and a sealed chamber for placing a die to-be-tested is formed at a region of the groove.