Semiconductor Die Stack Layout With Bent Wires to Cut Interference
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor die stacks with vertical wires experience significant electrical interference due to the close proximity of these wires, which affects the reliability and efficiency of signal transmission.
Innovation Solution
The semiconductor die stack incorporates bent wires to connect lower and upper pads in a staircase form, with vertical wires strategically spaced apart to reduce interference by being disposed on every other pair of pads connected by bent wires, and optionally using metal pillars instead of vertical wires for enhanced throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vertical wires are used to connect stacked semiconductor dies, then electrical connection between dies is achieved, but electrical interference among vertical wires increases due to close proximity
Solution Approach 1:
The patent transitions from purely vertical wire connections to a hybrid configuration incorporating bent wires that extend in lateral dimensions. The bent wires connect pads between stacked dies by extending horizontally and then vertically, effectively utilizing three-dimensional space to increase separation between connection paths and reduce electromagnetic interference while maintaining electrical connectivity.
Solution Approach 2:
The patent segments the wire connection paths into distinct bent and vertical components. By dividing the connection into multiple segments (bent wire portions and vertical wire portions) with different orientations and spatial positions, the design reduces the concentration of parallel current paths, thereby mitigating electrical interference while achieving the necessary electrical connections between stacked semiconductor dies.
2Productivity
If vertical wires are closely spaced to connect pads, then manufacturing density is improved, but electrical signal interference increases
Solution Approach 1:
The bent wire configuration utilizes lateral and vertical dimensions to achieve pad connections without requiring closely spaced vertical wires. By extending wires in multiple dimensions, the design maintains manufacturing density while increasing the effective spacing between current-carrying paths, thus reducing electrical signal interference.
Solution Approach 2:
The bent wires incorporate curved or angled paths rather than straight vertical lines. This curvature allows the wires to navigate between pads while maintaining greater separation from adjacent wires, reducing electromagnetic coupling and signal interference while still achieving the necessary connections for high-density packaging.
Data Source
AI summary
A semiconductor package includes a lower semiconductor die and an upper semiconductor die which are stacked with an offset in a first direction, wherein the lower semiconductor die includes a plurality of lower pads arranged in a second direction, which is perpendicular to the first direction, and wherein the upper semiconductor die includes a plurality of upper pads arranged in the second direction. The semiconductor package also includes bent wires electrically connecting the lower pads of the lower semiconductor die with the upper pads of the upper semiconductor die in the first direction. The semiconductor package further includes vertical wires such that a vertical wire is disposed on any one of the lower pad and the upper pad for each pair of pads electrically connected by a bent wire.