Die-Stacked Package Structure Eliminating Bumps for Thickness Reduction
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Solution Overview
Problem
The challenge is to miniaturize the package structure of electronic products to meet the trend of smaller, thinner, and lighter designs, while reducing overall volume and manufacturing costs.
Innovation Solution
A semiconductor package structure is developed with a die-stacked configuration, featuring a first and second redistribution layer, conductive pillars, and a die-stacked structure directly bonded to the second redistribution layer, eliminating the need for bumping structures or additional substrates, which simplifies the package structure and reduces thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional package structure with bumping structures and additional substrates is used, then electrical connection and structural support are achieved, but overall thickness and volume increase
Solution Approach 1:
The patent removes unnecessary components from the traditional package structure, specifically eliminating bumping structures and additional substrates. The die-stacked structure is directly bonded to the redistribution layer, extracting only the essential elements needed for electrical connection and structural support, thereby reducing overall volume and simplifying the package structure.
Solution Approach 2:
The patent merges multiple functions into fewer components. The die-stacked structure serves both as the electrical connection interface and the structural support element, eliminating the need for separate bumping structures and additional substrates. This consolidation reduces the number of discrete components and simplifies the overall package architecture.
2Length of stationary object
If die-stacked structure is directly bonded to redistribution layer without bumping structures, then thickness is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates preliminary alignment features during the fabrication process. Alignment marks are formed on the redistribution layer before the die-stacked structure is bonded. These pre-established alignment references enable precise positioning during the bonding process, ensuring accurate alignment without requiring excessive manufacturing precision throughout the entire process.
3Productivity
If traditional package structure with multiple components is used, then structural support and electrical connection are ensured, but manufacturing time and cost increase
Solution Approach 1:
The patent extracts and eliminates unnecessary manufacturing steps by removing bumping structures and additional substrates from the package structure. This reduction in components directly translates to fewer fabrication steps, less material handling, and simplified assembly processes, thereby improving manufacturing efficiency and reducing production time.
Solution Approach 2:
The patent combines multiple manufacturing operations into fewer integrated steps. The direct bonding of the die-stacked structure to the redistribution layer merges the electrical connection formation and structural assembly into a single bonding operation, eliminating the need for separate bumping formation, substrate assembly, and alignment steps required in traditional processes.
Data Source
AI summary
A package structure includes a first redistribution layer, a second redistribution layer, a die, a plurality of conductive pillars and a die-stacked structure. The first redistribution layer has a first surface and a second surface opposite to the first surface. The second redistribution layer is disposed above the first surface. The die is disposed between the first redistribution layer and the second redistribution layer and has an active surface and a rear surface opposite to the active surface. The active surface is adhered to the first surface, and the die is electrically connected to the first redistribution layer. The conductive pillars are disposed and electrically connected between the first redistribution layer and the second redistribution layer. The die-stacked structure is bonded on the second redistribution layer.