Die Support Structure for Crack-Free Wafer Singulation

Solution Overview

Problem

Conventional semiconductor package manufacturing methods using sawing techniques result in chipping and cracking of die sidewalls, limiting the production of non-rectangular shapes and compromising package reliability.

Innovation Solution

The use of etching techniques to form notches in semiconductor wafers, followed by applying a mold compound and singulating the substrate into packages, which eliminates sidewall cracks and allows for various die perimeter shapes, including non-rectangular forms.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If sawing techniques are used to singulate semiconductor substrates, then productivity is improved, but manufacturing precision deteriorates due to chipping and cracking of die sidewalls

Engineering Contradiction:

Improveproduction efficiencyVSAvoidsidewall integrity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent replaces the mechanical sawing process with a chemical etching process. Instead of using a physical saw blade to cut through the semiconductor substrate, the invention uses etching techniques to form notches and separate the substrate into individual packages. This substitution eliminates the mechanical contact that causes chipping and cracking, thereby maintaining sidewall integrity while still achieving singulation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the fundamental parameter of the singulation process from mechanical force to chemical reaction. By controlling etching parameters such as etchant composition, temperature, and exposure time, the process achieves precise separation without the mechanical stress that damages die sidewalls. This parameter change allows for high precision manufacturing while maintaining productivity.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If sawing techniques are used to singulate semiconductor substrates, then productivity is improved, but reliability deteriorates due to sidewall damage

Engineering Contradiction:

Improveproduction efficiencyVSAvoidpackage reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent replaces the mechanical sawing process with a chemical etching process. Instead of using a physical saw blade to cut through the semiconductor substrate, the invention uses etching techniques to form notches and separate the substrate into individual packages. This substitution eliminates the mechanical contact that causes chipping and cracking, thereby maintaining sidewall integrity while still achieving singulation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention converts the potential harm of chemical etching (which could damage the substrate if not controlled) into a benefit by carefully controlling the etching process to selectively remove material only where notches are required. The controlled chemical reaction that could potentially cause damage is instead used to create precise, damage-free separations that enhance package reliability.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Ease of manufacture

If conventional sawing techniques are used, then manufacturing process is simple, but adaptability deteriorates as non-rectangular shapes cannot be produced

Engineering Contradiction:

Improveprocess simplicityVSAvoiddie shape variety

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The invention changes the fundamental parameter of the singulation process from mechanical force to chemical reaction. By controlling etching parameters such as etchant composition, temperature, and exposure time, the process achieves precise separation without the mechanical stress that damages die sidewalls. This parameter change allows for high precision manufacturing while maintaining productivity.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The etching process applies different local qualities to different regions of the semiconductor substrate. By using photomasks or direct laser writing, the etching can be selectively applied to create various shapes and patterns. This allows non-rectangular shapes to be produced with the same basic process, greatly enhancing adaptability while maintaining ease of manufacture.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances semiconductor package reliability by preventing sidewall damage and enabling the production of diverse die shapes beyond traditional rectangular forms.

Implementation Method 1

The mold compound may be applied into the plurality of notches and over the first side of the semiconductor substrate. The mold compound may be cured to form a permanent coating.

Methodology Applied

Scientific EffectCuring:

Data Source

PatentUS20250349549A1Semiconductor devices having die support structures and related methods

Publication Date: 2025.11.13 SEMICON COMPONENTS IND LLC

AI summary

Various implementations of a method of forming a semiconductor package may include forming a plurality of notches into the first side of a semiconductor substrate; applying a permanent coating material into the plurality of notches; forming a first organic material over the first side of the semiconductor substrate and the plurality of notches; thinning a second side of the semiconductor substrate opposite the first side one of to or into the plurality of notches; and singulating the semiconductor substrate through the permanent coating material into a plurality of semiconductor packages.