Die-to-Die Interconnects with Ground Webbing for Crosstalk Reduction

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Solution Overview

Problem

There is a need for an inexpensive and high-throughput process to manufacture semiconductor device packages that provide stable and clean high-frequency data signal transmission between integrated circuit chips and package devices, with improved yield and mechanical stability, while reducing crosstalk and increasing frequency capabilities up to 25 gigatransfers per second.

Innovation Solution

The implementation of die-to-die channel interconnect configurations, including on-die inductor structures, interconnection features, ground webbing structures, high-speed horizontal data signal transmission lines, vertical data signal transmission interconnects, and electro-optical connectors, which isolate data signal channels and reduce crosstalk through conductive material shielding and ground webbing, enabling efficient data transfer between chips and package devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional packaging and routing methods are used, then manufacturing cost is reduced and process is simpler, but data signal transmission frequency is limited and crosstalk increases

Engineering Contradiction:

Improvedata signal transmission qualityVSAvoidinterconnect structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent segments the data signal transmission path into multiple isolated channels with dedicated ground webbing structures. Each data signal channel is separated by ground isolation webbing, creating discrete transmission paths that prevent crosstalk while maintaining manufacturability through modular construction

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Ground webbing structures serve as intermediary elements between adjacent data signal channels. These ground isolation webbing structures act as shielding intermediaries that block electromagnetic interference between channels, enabling high-frequency transmission without direct signal-to-signal interference

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If ground webbing structures and shielding are implemented, then crosstalk is reduced and signal quality improves, but manufacturing process complexity increases

Engineering Contradiction:

Improvesignal stabilityVSAvoidmanufacturing process simplicity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

Ground webbing structures are formed preliminarily during the packaging process before final assembly. The ground isolation webbing is integrated into the package substrate during manufacturing, establishing shielding pathways in advance that simplify subsequent assembly steps while ensuring signal stability

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent modifies manufacturing parameters by using standard PCB fabrication techniques to create ground webbing structures. By changing the approach to use conventional manufacturing processes with updated design parameters, the patent achieves complex shielding structures without proportionally increasing manufacturing difficulty

Inventive Principle:

Principle #35Parameter changes

3Speed

If traditional routing is used, then device complexity is lower, but frequency capability is limited to below 50 MHz

Engineering Contradiction:

Improvedata transmission frequencyVSAvoidinterconnect configuration

Core Design Contradiction:

SpeedVSDevice complexity

Solution Approach 1:

The patent transitions from planar two-dimensional routing to three-dimensional interconnect configurations. Vertical vias and multi-layer ground webbing structures create third-dimensional shielding paths, enabling high-frequency signal transmission by adding spatial dimensions to the interconnect architecture

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The interconnect structure uses composite construction combining conductive ground webbing materials with insulating package substrates. This composite approach creates effective electromagnetic shielding that enables high-frequency operation while maintaining structural integrity and manufacturability

Inventive Principle:

Principle #40Composite materials

4Productivity

If high-frequency transmission is implemented, then data transfer rate increases, but crosstalk and signal interference increase

Engineering Contradiction:

Improvedata throughputVSAvoidcrosstalk

Core Design Contradiction:

ProductivityVSObject-generated harmful factors

Solution Approach 1:

The patent converts the potentially harmful electromagnetic fields between adjacent channels into beneficial shielding effects. Ground webbing structures capture and redirect electromagnetic energy that would otherwise cause crosstalk, transforming interference potential into protective shielding that enables higher data throughput

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Data Source

PatentUS10784204B2Rlink—die to die channel interconnect configurations to improve signaling

Publication Date: 2020.09.22 TAHOE RES LTD

AI summary

Integrated circuit (IC) chip die to die channel interconnect configurations (systems and methods for their manufacture) may improve signaling to and through a single ended bus data signal communication channel by including on-die induction structures; on-die interconnect features; on-package first level die bump designs and ground webbing structures; on-package high speed horizontal data signal transmission lines; on-package vertical data signal transmission interconnects; and/or on-package electro-optical (EO) connectors in various die to die interconnect configurations for improved signal connections and transmission through a data signal channel extending through one or more semiconductor device package devices, that may include an electro-optical (EO) connector upon which at least one package device may be mounted, and/or be semiconductor device packages in a package-on-package configuration.