Die-to-Die Level Shifting Circuitry for Mixed-Voltage SiP Communication
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Solution Overview
Problem
The semiconductor industry faces challenges with System-in-Package (SiP) products due to rising mask costs, uneven technology shrink factors, and inefficiencies in existing pad structures for package I/O and chip-to-chip communication, which are not cost, frequency, latency, or power efficient, and new transistor topologies below 20 nm are not effective solutions for all circuit types.
Innovation Solution
A system-in-package (SiP) that includes die-to-die output and input circuitry capable of selectively level shifting signals between different internal voltage levels, using selection circuitry to couple or decouple supply voltage terminals based on the voltage levels of each die, allowing communication between dies with different internal voltage levels, and utilizing a reference terminal to ensure compatible voltage levels for signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing pad structures are used for package I/O and chip-to-chip communication, then standard communication protocols can be implemented, but cost efficiency, frequency efficiency, latency, and power efficiency are compromised
Solution Approach 1:
The system divides the communication interface into separate functional blocks: first die-to-die output circuitry, first die-to-die input circuitry, second die-to-die output circuitry, and second die-to-die input circuitry. Each block is independently configurable to optimize for specific communication requirements, allowing the system to achieve both reliability and cost efficiency by selecting appropriate configurations rather than using fixed standard pad structures
Solution Approach 2:
The patent implements dynamic voltage level selection through selection circuitry that can couple or decouple supply voltage terminals based on operating conditions. The die-to-die output circuitry can selectively level shift signals between different internal voltage levels (first and second voltage levels), allowing the system to adapt its communication parameters dynamically to optimize performance and power efficiency for different communication scenarios
2Adaptability or versatility
If dies with different internal voltage levels are used in a SiP to optimize for different circuit types, then design flexibility and cost efficiency improve, but signal transmission compatibility becomes problematic
Solution Approach 1:
The die-to-die output circuitry acts as an intermediary between dies with different voltage levels. It includes level shifting functionality that can convert signals from a first internal voltage level to a second internal voltage level, and vice versa. This intermediary circuitry ensures compatible signal transmission between dies with different internal voltage levels while maintaining the design flexibility to use different voltage levels for optimization
Solution Approach 2:
The system changes the voltage level parameter of signals dynamically based on the operating conditions and the voltage levels of connected dies. Selection circuitry configured to couple or decouple supply voltage terminals allows the system to adjust voltage levels at different operational states, ensuring compatibility while maintaining the ability to use different voltage levels for different circuit types
3Reliability
If signal level shifting is implemented between dies with different voltage levels, then voltage compatibility is achieved, but additional circuitry and power consumption are introduced
Solution Approach 1:
The level shifting functionality is implemented dynamically through selection circuitry that can couple or decouple supply voltage terminals based on operating conditions. The die-to-die output circuitry selectively enables level shifting only when voltage level mismatch exists, avoiding unnecessary power consumption when dies operate at compatible voltage levels while maintaining voltage compatibility when needed
Data Source
Figure 1
Figure 2
AI summary
A system in a package (SIP) (200) has a first die (102) with a first internal voltage level (VDDI1), first die-to-die output circuitry (108), first die-to-die input circuitry (110), and first internal logic (106) and a second die (104) with a second internal voltage level (VDDI2), second die-to-die output circuitry (114), second die-to-die input circuitry (112), and second internal logic (116). A first signal (106 out to 108) is provided to the second internal logic (116) via the first die-to-die output circuity (108) and the second die-to-die input circuitry (112), wherein each of the first die-to-die output circuitry and second die-to-die input circuitry selectively (202, 204) level shift the first signal based on the first (VDDI1) and second (VDDI2) internal voltage levels. A second signal (116 out to 114) is provided to the first internal logic (106) via the second die-to-die output circuity (114) and the first die-to-die input circuitry (110), wherein each of the second die-to-die output circuitry and first die-to-die input circuitry selectively (204, 202) level shift the second signal based on the first (VDDI1) and second (VDDI2) internal voltage levels.