Replacing resistor biasing with a superconducting transformer cuts static power dissipation and cooling load in Josephson junction circuits.
Latch-based retiming and decoding in an IC context switcher keeps configuration data continuous while reducing circuit complexity and power.
An AC transformer and Josephson junction regenerate SFQ pulses without resistive damping, cutting heat dissipation in superconducting logic.
A clamp signal forces sequential outputs to low-leakage values in sleep mode while preserving state for fast recovery.
Transformer-coupled AC power and Josephson junction pulse regeneration cut heat dissipation and signal loss in ballistic SFQ logic circuits.
Tracks SRAM cell threshold voltage to hold virtual ground near VDD−1.5Vth, cutting standby leakage while preserving data retention.
Complementary security traces use isolation, charge sharing, and comparators to cancel capacitive coupling and cut active shield power.
A decoder-interconnect-encoder logic circuit keeps Hamming weight constant to suppress power fluctuation, heat, and battery drain.
A busy-triggered I2C level shifter cuts standby current and avoids extra reference voltages while switching fast enough for high-speed data.
Die-to-die output circuitry selectively level shifts signals between different internal voltage levels in a system-in-package.
A hierarchical power shutdown system manages independent domain priorities to minimize voltage drop and enable rapid data recovery.
Intermediary logic circuits discharge floating gate voltages before power switches open, reducing leakage currents by up to 20 times.
A semiconductor integrated circuit adjusts threshold and supply voltages by monitoring switching and leakage currents to minimize operational power.
Sleep mode control logic decouples unprogrammed antifuses from input signals, eliminating cumulative leakage currents during low-power operation.
Programmable bulk voltage modulation reduces sub-threshold leakage while maintaining circuit state, eliminating latency from full power cycling.
A third power grid enables switch placement in dense flip-chip packages, reducing planar complexity and power consumption.