Die-to-Die Spacer for IC Communication Yield
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Integrated circuits face yield loss due to increased defect density as die complexity grows, and existing methods like silicon bridges and interposers present assembly challenges and signal integrity issues for die-to-die communication.
Innovation Solution
A multi-die integrated circuit device with a spacer that facilitates direct electrical contact between dice and a substrate without passing through the spacer, using conductive posts and underfill to connect dice to the substrate, and high-density wiring for efficient die-to-die communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If silicon bridges are used to interconnect dice for die-to-die communication, then communication capability is improved, but assembly challenges and signal integrity issues occur
Solution Approach 1:
The patent introduces an interposer as an intermediary substrate that facilitates die-to-die communication. The interposer contains through-silicon vias (TSVs) that provide electrical pathways between dice, replacing direct silicon bridge connections. This mediator approach resolves the contradiction by enabling high-speed communication through the interposer's controlled impedance pathways while avoiding the assembly challenges of direct silicon bonding.
Solution Approach 2:
The patent segments the integrated circuit into multiple independent dice that are mounted on a separate interposer substrate. This segmentation allows each die to be optimized independently while the interposer provides the communication infrastructure. The segmentation resolves the contradiction by separating the communication function (handled by interposer TSVs) from the computational function (handled by individual dice), enabling high-speed communication without compromising assembly reliability.
2Adaptability or versatility
If Si interposers are used to interconnect dice, then die-to-die communication is enabled, but through-Si-via processes and assembly challenges arise
Solution Approach 1:
The patent performs preliminary actions by pre-fabricating the interposer substrate with through-silicon via pathways before mounting the dice. The TSV structures are created in advance during interposer fabrication, allowing subsequent dice mounting to be a simpler process. This preliminary action resolves the contradiction by separating the complex via formation process from the dice assembly process, enabling versatile interconnection while simplifying overall manufacturing.
3Adaptability or versatility
If die size is increased to accommodate more components, then functionality is improved, but defect density increases and yield decreases
Solution Approach 1:
The patent divides a large-scale integrated circuit into multiple smaller dice, each containing a portion of the total functionality. This segmentation reduces the area of individual dice, thereby reducing defect density and improving yield for each die. The complete functionality is restored through die-to-die communication via the interposer, resolving the contradiction between functionality and reliability.
4Reliability
If dice are split to reduce density, then defect rate is reduced, but communication requirements increase
Solution Approach 1:
The patent uses an interposer as a mediator that provides optimized communication pathways between split dice. The interposer's TSV structures and controlled impedance pathways enable high-speed signal transmission that meets the increased communication requirements resulting from die splitting. This resolves the contradiction by providing dedicated communication infrastructure that maintains high speed despite the increased number of dice.
Data Source
AI summary
A multi-die integrated circuit device and a method of fabricating the multi-die integrated circuit device involve a substrate. Two or more dice include components that implement functionality of the multi-die integrated circuit. The components include logic gates. The multi-die integrated circuit device also includes a spacer disposed between the substrate and each of the two or more dice. Each of the two or more dice makes direct electrical contact with the substrate without making direct electrical contact with the spacer through holes in the spacer.