Dielectric Composition for Thin MLCC Layers With Higher Withstand Voltage
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The miniaturization and high capacitance requirements of multilayer ceramic electronic components lead to deteriorated withstand voltage and reliability characteristics due to thinning of dielectric layers, with challenges in maintaining high dielectric constant and DC-bias characteristics while preventing reliability degradation.
Innovation Solution
A dielectric material comprising (Ba1-xCax)(Ti1-y(Zr, Sn, Hf)y)O3 with specific subcomponents like Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Nb, Tb, Eu, Tm, La, Lu, Yb, Si, Al, and Ba/Ca, controlled by relational expressions to optimize grain boundaries and minimize charge flow, enhancing withstand voltage and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the dielectric layer is thinned to meet miniaturization and high capacitance requirements, then the capacitance and miniaturization are improved, but the withstand voltage and reliability characteristics deteriorate
Solution Approach 1:
The patent applies local quality by creating distinct regions within the dielectric layer with different properties: grain interiors with specific characteristics and grain boundaries with modified composition (higher ratio of A-site cations like Ba and Ca). This local differentiation allows the grain boundaries to provide higher resistance and better withstand voltage characteristics while the grain interiors maintain the dielectric constant, thus resolving the contradiction between miniaturization and reliability
Solution Approach 2:
The patent uses composite materials by combining multiple cation elements (Ba, Ca, Ti, Zr, Sn, Hf) in specific ratios to create a dielectric layer with optimized properties. The composite structure with controlled distribution of different cations allows simultaneous achievement of high capacitance through thinning and maintained withstand voltage through enhanced grain boundary resistance
2Volume of moving object
If the dielectric layer is thinned for miniaturization, then the component size is reduced, but the microstructure uniformity and reliability deteriorate
Solution Approach 1:
The patent applies parameter changes by precisely controlling the composition ratios of multiple cation elements (Ba, Ca, Ti, Zr, Sn, Hf) and their distribution within the dielectric layer. By adjusting these parameters, the patent achieves uniform microstructure even in thinned dielectric layers, maintaining reliability while enabling miniaturization
3Reliability
If the grain boundary ratio is increased to improve reliability, then the withstand voltage improves, but the dielectric constant and capacitance characteristics deteriorate
Solution Approach 1:
The patent resolves this contradiction by applying local quality differently: grain boundaries are engineered with high resistance characteristics through specific cation composition (higher A-site cation ratio) to improve withstand voltage, while grain interiors are optimized for dielectric constant. This spatial differentiation of functions allows both high reliability and high dielectric constant to coexist
Solution Approach 2:
The patent uses parameter changes to control the balance between grain boundary resistance and grain interior dielectric properties. By adjusting the overall cation ratios and their distribution parameters, the patent optimizes the contribution of grain boundaries to withstand voltage while maintaining the grain interiors' contribution to dielectric constant, thus resolving the trade-off
Data Source
AI summary
A dielectric material includes a main component represented by (Ba1-xCax)(Ti1-y(Zr, Sn, Hf)y)O3 (0≤x≤1 and 0≤y≤0.5); a first subcomponent including at least one of elements among Y, Dy, Ho, Er, Gd, Ce, Nd, Nb, Sm, Tb, Eu, Tm, La, Lu, and Yb; a second subcomponent including Si and/or Al; and a third subcomponent including Ba and/or Ca.