Dielectric Film IC Package Thickness Reduction
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Solution Overview
Problem
Current integrated circuit (IC) packaging technologies result in thick packages due to multiple re-distribution layers, which are time-consuming and costly to fabricate, and there is a need for a simplified method to produce complex IC packages with reduced thickness.
Innovation Solution
The method involves using a dielectric film with adhesive properties to affix dies and form vias without additional adhesives, allowing for direct bonding and reduced thickness through the elimination of conventional adhesive layers between re-distribution layers, and utilizing die studs to create interconnects within the film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple re-distribution layers are used to achieve increased number of interconnect layers, then electrical connectivity and performance are improved, but package thickness increases
Solution Approach 1:
The patent combines the adhesive layer and dielectric layer into a single integrated re-distribution layer. The dielectric material itself provides adhesive properties to bond dies, eliminating the need for separate adhesive layers between re-distribution layers, thus reducing package thickness while maintaining electrical connectivity
Solution Approach 2:
The dielectric material is designed to perform multiple functions simultaneously: it serves as the insulating dielectric layer, provides adhesive bonding between dies, and forms the re-distribution layer for electrical interconnects. This multi-functionality eliminates the need for separate adhesive layers
2Strength
If conventional adhesive layers are used between re-distribution layers, then bonding strength is improved, but package thickness increases
Solution Approach 1:
The adhesive layer and dielectric layer are merged into a single integrated layer. The dielectric material inherently provides adhesive properties through its chemical composition, allowing it to bond dies directly without requiring a separate adhesive layer, thus maintaining bonding strength while reducing thickness
3Reliability
If multiple additional re-distribution layers are added to achieve complex interconnects, then electrical performance is improved, but fabrication time and cost increase
Solution Approach 1:
The dielectric material performs multiple functions in one layer: it provides electrical insulation, mechanical bonding, and serves as the substrate for metal interconnect traces. This multi-functionality reduces the number of separate fabrication steps and layers needed, improving fabrication efficiency while achieving complex interconnect structures
Solution Approach 2:
Multiple functional layers (adhesive, dielectric, and re-distribution substrate) are combined into a single integrated re-distribution layer, reducing the total number of fabrication steps required to build complex multi-layer interconnect structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the overall thickness of IC packages by eliminating unnecessary adhesive layers and simplifies the fabrication process, enabling more complex and intricate designs while maintaining electrical connectivity.
Implementation Method 1
affixing an electrical component to a first surface of the dielectric film via an adhesive property of the dielectric film
Implementation Method 2
A via is formed through the dielectric film by the die stud
Data Source
AI summary
An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side. The package also includes a die having an active surface affixed to a contact location of the first side of the dielectric film. A die stud is affixed to the active surface of the die and extends through the dielectric film to an interconnect location of the second side of the dielectric film.