Attenuating Dielectric Layers for High-Frequency EMI Isolation
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Solution Overview
Problem
High frequency applications experience increased electromagnetic interference and crosstalk due to radiation from conducting areas into adjacent dielectrics or air, leading to performance degradation.
Innovation Solution
Incorporation of dielectric materials with attenuation properties between areas radiating and receiving electromagnetic interference signals, providing an attenuation of more than 5 dB/cm in specific frequency ranges, including scattering or absorption mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conducting areas or interconnects are used in high frequency applications, then electrical connectivity and signal transmission are achieved, but electromagnetic radiation and crosstalk increase
Solution Approach 1:
A dielectric material with attenuation properties is introduced as an intermediary substance between conducting areas and receiving areas. This material absorbs and attenuates electromagnetic radiation, preventing crosstalk while allowing necessary signal transmission through its controlled attenuation characteristics (>5 dB/cm in specific frequency ranges).
Solution Approach 2:
The dielectric material's attenuation parameter is specifically optimized to exceed 5 dB/cm in frequency ranges of 1 GHz to 10 GHz. By changing and controlling this attenuation parameter, the material effectively reduces electromagnetic radiation without compromising the electrical connectivity function.
2Object-generated harmful factors
If dielectric materials are placed between radiating and receiving areas, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The dielectric material serves multiple functions simultaneously: it provides electrical insulation between conducting areas, attenuates electromagnetic radiation, and reduces crosstalk. By combining these functions in a single material layer, the solution reduces electromagnetic interference without proportionally increasing device complexity.
3Reliability
If encapsulation material is used to encapsulate high frequency chip, then chip protection and integration are improved, but electromagnetic radiation shielding may be insufficient
Solution Approach 1:
The encapsulation material is formulated as a composite with specific dielectric properties and attenuation characteristics. By combining base encapsulation materials with attenuating dielectric materials, the composite achieves both mechanical protection/integration functions and electromagnetic radiation shielding, preventing radiation leakage while maintaining chip encapsulation reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces electromagnetic interference and crosstalk, enhancing the performance and reliability of high frequency devices by effectively attenuating electromagnetic signals.
Implementation Method 1
an attenuation of the dielectric material is more than 5 dB/cm at least in a subrange of the first frequency range
Implementation Method 2
providing an attenuation of more than 5 dB/cm in specific frequency ranges, including scattering or absorption mechanisms
Data Source
AI summary
A device includes a high frequency chip and a dielectric material arranged between a first area radiating an electromagnetic interference signal in a first frequency range between 1 GHz and 1 THz and a second area receiving the electromagnetic interference signal. An attenuation of the dielectric material is more than 5 dB/cm at least in a subrange of the first frequency range.