Embedded Inductors Using Dielectric Magnetic Fillers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The integration of conductive magnetic filler particles in inductors for electronic substrates poses challenges due to signal interference and the difficulty in coating them with non-conductive materials, which can reduce magnetic properties and stability during processing.
Innovation Solution
Incorporating dielectric magnetic filler particles with high resistivity and permeability within a carrier material, such as polymer resin, to form a magnetic material layer in inductors, allowing for the formation of inductors with conductive vias that minimize signal disruption while maintaining magnetic properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive magnetic filler particles are used in inductors, then magnetic properties are improved, but signal interference and crosstalk increase
Solution Approach 1:
The patent changes the electrical conductivity parameter of the magnetic filler particles from conductive to dielectric (highly resistive). By selecting magnetic particles with inherently high electrical resistivity (greater than 10^-7 ohm-meters), the patent eliminates signal interference while preserving magnetic properties, resolving the contradiction between magnetic performance and signal integrity.
Solution Approach 2:
The patent converts the typically harmful effect of magnetic particle conductivity into a beneficial feature by deliberately selecting dielectric magnetic particles. The high electrical resistivity that would normally be considered a limitation for magnetic performance is instead exploited to eliminate signal interference, turning a potential harm into a benefit for overall inductor performance.
2Object-generated harmful factors
If non-conductive coating is applied to magnetic filler particles, then signal interference is reduced, but magnetic properties are diminished
Solution Approach 1:
The patent extracts the need for non-conductive coating entirely by selecting magnetic filler particles that are inherently dielectric. By removing the coating step, the patent avoids the loss of magnetic properties that occurs during coating application while still achieving the goal of reducing signal interference through the particles' intrinsic high resistivity.
Solution Approach 2:
Instead of applying a non-conductive coating to make conductive particles non-conductive, the patent inverts the approach by selecting particles that are naturally non-conductive (dielectric). This reversal eliminates the need for coating while preserving magnetic properties, as the particles' inherent dielectric nature provides both signal isolation and magnetic functionality.
3Reliability
If non-conductive coating is applied to magnetic filler particles, then electrical stability is improved, but thermal and chemical stability deteriorate
Solution Approach 1:
The patent removes the non-conductive coating layer entirely, exposing the magnetic filler particles directly. This eliminates the coating's thermal and chemical instability issues while maintaining electrical stability through the particles' inherent dielectric properties. The direct exposure of stable magnetic particles to the environment provides superior overall stability.
4Volume of moving object
If inductors are embedded in electronic substrates, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent changes the electrical parameter of the magnetic filler particles to dielectric, which simplifies the manufacturing process for embedded inductors. The high resistivity of the particles eliminates the need for additional insulation layers and complex alignment processes, reducing manufacturing complexity while maintaining the size benefits of embedded inductors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of inductors embedded in electronic substrates that reduce signal interference and maintain magnetic properties, supporting the development of faster and smaller integrated circuit devices with improved power delivery.
Implementation Method 1
dielectric magnetic filler particles with high resistivity and permeability
Implementation Method 2
dielectric magnetic filler particles with high resistivity and permeability
Data Source
AI summary
An inductor may be fabricated comprising a magnetic material layer and an electrically conductive via or trace extending through the magnetic material layer, wherein the magnetic material layer comprises dielectric magnetic filler particles within a carrier material. Further embodiments may include incorporating the inductor of the present description into an electronic substrate and may further include an integrated circuit device attached to the electronic substrate and the electronic substrate may further be attached to a board, such as a motherboard.