Dielectric Moisture Control for Copper Clad Laminate Blistering
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Solution Overview
Problem
Existing dielectrics used in high-frequency printed wiring boards cause blistering of copper foils during laminate production due to uncontrolled moisture content and inadequate electrical characteristics, leading to increased transmission loss.
Innovation Solution
A dielectric with a moisture content of 1000 µg/g or less, composed of a non-melt-processible fluororesin like PTFE and an inorganic filler such as silica, coated with a silane coupling agent, is used, along with a copper foil with a surface roughness of 2.0 µm or less, to prevent blistering and enhance electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a fluororesin compounded with filler is used as wiring board material, then electrical characteristics are improved, but copper foil blistering occurs during laminate production
Solution Approach 1:
The patent applies parameter changes by strictly controlling the moisture content of the fluororesin compound to 1000 μg/g or less. This parameter control prevents copper foil blistering during laminate production while maintaining the electrical characteristics provided by the fluororesin and filler composition.
Solution Approach 2:
The patent uses a silane coupling agent as an intermediary substance that coats the filler particles. This intermediary improves the interface between the fluororesin matrix and the filler, enhancing electrical performance while the controlled moisture content prevents blistering of the copper foil during lamination.
2Ease of manufacture
If moisture content in dielectric is not controlled, then manufacturing is easier, but copper foil blistering occurs and electrical characteristics deteriorate
Solution Approach 1:
The patent implements parameter changes by establishing and maintaining moisture content at 1000 μg/g or less throughout the dielectric production process. This parameter control ensures both the electrical characteristics and the prevention of copper foil blistering, while the standardized production method maintains ease of manufacture.
3Reliability
If filler content is increased to improve electrical characteristics, then dielectric performance improves, but moisture content control becomes more difficult
Solution Approach 1:
The patent employs a silane coupling agent as an intermediary that coats the filler particles. This intermediary treatment improves the compatibility between the filler and fluororesin matrix, allowing higher filler content for better electrical characteristics while the silane coating helps maintain lower moisture content, simplifying moisture control.
Solution Approach 2:
The patent creates a composite material system consisting of fluororesin, filler with silane coupling agent coating, and controlled moisture content. This composite structure achieves improved electrical characteristics through high filler content while the silane-modified interface prevents moisture accumulation, reducing the complexity of moisture control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dielectric achieves low dielectric constant and loss, preventing copper foil blistering and ensuring excellent electrical characteristics in copper-clad laminates.
Implementation Method 1
the silica has a surface coated with a silane coupling agent
Implementation Method 2
A dielectric with a moisture content of 1000 µg/g or less... preventing copper foil blistering
Data Source
AI summary
A dielectric that has excellent electrical characteristics and causes no blistering of a copper foil during production of a copper-clad laminate using the dielectric, and a method for producing the same are provided. Further, a copper-clad laminate using the dielectric, and a method for producing the same are provided. A dielectric has a moisture content of 1000 µg/g or less. The metal-clad laminate has the dielectric and a metal foil.