Dielectric Composition with Nitrogen Substitution for High-Temperature Insulation

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Solution Overview

Problem

There is a demand for dielectric compositions with higher relative permittivity and insulation resistance at high temperatures, which existing technologies have not adequately addressed.

Innovation Solution

A dielectric composition with the formula (Sr1-x, Cax)m(Ti1-yHfy)O3-δNδ, where 0<x≤0.15, 0<y≤0.15, 0.90≤m≤1.15, and 0<δ≤0.05, is used to create a dielectric thin film that achieves high relative permittivity and insulation resistance at high temperatures, incorporating nitrogen to enhance these properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional dielectric compositions are used, then manufacturing cost is reduced, but relative permittivity and insulation resistance at high temperature are insufficient

Engineering Contradiction:
Improveinsulation resistance at high temperatureVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies parameter changes by precisely controlling the compositional parameters (x, y, m, δ) in the dielectric composition formula (Sr1-x, Cax)m(Ti1-yHfy)O3-δNδ. By optimizing these parameters within specific ranges, the invention achieves high relative permittivity (≥200) and high insulation resistance at 125°C (≥1×10^8 Ω) while maintaining compatibility with low-temperature sintering processes, thus improving reliability without significantly increasing manufacturing cost

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by creating a multi-element dielectric system combining Sr, Ca, Ti, Hf, O, and N. This composite approach leverages the synergistic effects of different elements: Sr and Ca provide high permittivity, Ti and Hf enhance insulation properties, and nitrogen substitution improves both permittivity and thermal stability. The composite composition achieves superior high-temperature performance that cannot be obtained with single-element or simple binary systems

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The dielectric composition effectively maintains high electric capacity and insulation resistance at elevated temperatures, with the nitrogen substitution improving insulation resistance while maintaining high electric capacity.

Implementation Method 1

a dielectric composition having a main component expressed by a compositional formula (Sr1-x, Cax)m(Ti1-yHfy)O3-δNδ

Methodology Applied
Scientific EffectNitrogen substitution: Dopants

Data Source

PatentUS11551867B2Dielectric composition, dielectric thin film, dielectric element, and electronic circuit board
Publication Date: 2023.01.10 TDK CORP
  • US11551867B2 patent drawing
  • US11551867B2 patent drawing
  • US11551867B2 patent drawing

AI summary

The present invention provides a dielectric composition having high relative permittivity and insulation resistance at high temperature. The dielectric composition includes a main component expressed by a compositional formula (Sr1-x, Cax)m(Ti1-yHfy)O3-δNδ, in which 0&lt;x≤0.15, 0&lt;y≤0.15, 0.90≤m≤1.15, and 0&lt;δ≤0.05 are satisfied.