Dielectric Plate Alignment for Uniform Substrate Edge Etching
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Solution Overview
Problem
Existing bevel etching apparatuses face spatial constraints and increased volume due to separate structures for moving dielectric plates, affecting the efficiency of plasma treatment on substrate edges.
Innovation Solution
A substrate treatment apparatus with a housing, support unit, dielectric plate unit, and upper electrode unit, featuring shape portions for alignment and a driving member to lift and lower the support unit, allowing precise positioning of the dielectric plate relative to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a separate structure for moving the dielectric plate is included, then the dielectric plate can be positioned, but the apparatus volume increases and spatial constraints are caused
Solution Approach 1:
The dielectric plate is integrated directly onto the support unit, eliminating the need for separate moving structures. The support unit serves dual functions: supporting the substrate and positioning the dielectric plate, thereby reducing apparatus volume while maintaining positioning precision
Solution Approach 2:
The support unit is designed to perform multiple functions: it supports the substrate, positions the dielectric plate, and enables relative movement between the dielectric plate and substrate. This multi-functionality eliminates the need for dedicated moving mechanisms, reducing overall apparatus volume
2Manufacturing precision
If a separate structure for moving the dielectric plate is included, then the dielectric plate can be positioned, but spatial constraints are caused in forming the interior
Solution Approach 1:
The dielectric plate and support unit are integrated into a single assembly, simplifying the interior structure by eliminating separate moving mechanisms while maintaining the capability for precise relative position adjustment between the dielectric plate and substrate
Solution Approach 2:
The support unit is designed to be movable relative to the substrate, allowing dynamic adjustment of the dielectric plate position. This enables precise positioning without requiring complex fixed structures, simplifying the overall device design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the efficiency and uniformity of plasma treatment on substrate edges by improving the alignment and positioning of the dielectric plate, ensuring balanced etching.
Implementation Method 1
Plasma is an ionized gas state including ions, radicals, electrons, etc., and is generated in response to very high temperatures, strong electric fields, or radio frequency (RF) electromagnetic fields. A semiconductor device manufacturing process includes an ashing or etching process to remove a film material from a substrate by using plasma.
Data Source
AI summary
Provided is an apparatus for treating a substrate. The apparatus for treating the substrate includes a housing defining a treatment space formed by a combination of an upper housing and a lower housing, a gas supply unit configured to supply gas to the treatment space, a support unit including a chuck configured to support the substrate in the treatment space and an upper electrode provided to surround the check when viewed from a top view, a dielectric plate unit including a dielectric plate arranged to oppose the substrate supported by the support unit in the treatment space, and an upper electrode unit coupled to the dielectric plate unit and including an upper electrode arranged to oppose the lower electrode, in which the upper electrode unit is coupled to the lower housing.