Dielectric Sheet Lamination for Void-Free Electronic Component Packages
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Solution Overview
Problem
The existing methods for forming electronic component packages result in misalignment and loss of yield due to the displacement of components during the molding process, leading to increased costs and non-uniformities in the package body, particularly for high aspect ratio spaces.
Innovation Solution
A method involving the attachment of electronic components to a carrier with high aspect ratio spaces, followed by lamination with a dielectric sheet using a low-cost lamination system, which completely fills the spaces and ensures a planar upper surface without voids or ripples.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If molding compound is injected around electronic components, then the components are encapsulated and protected, but the components are moved and displaced due to the force of the injected molding compound resulting in misalignment and loss of yield
Solution Approach 1:
The patent applies preliminary action by first attaching a release sheet to the molding compound before injection, and then removing it after curing. This preliminary placement and subsequent removal prevents the molding compound force from displacing the electronic components, maintaining alignment while still achieving encapsulation. The release sheet is positioned in advance to counteract the harmful effect of injection force.
2Volume of stationary object
If molding compound is injected to fill spaces between components, then the package body is formed, but voids remain in high aspect ratio spaces due to incomplete filling
Solution Approach 1:
The patent uses a release sheet as an intermediary tool to improve molding compound flow into high aspect ratio spaces. The release sheet temporarily occupies the space above components, forcing the molding compound to flow laterally and completely fill the vertical spaces between components. After curing, the release sheet is removed, leaving a void-free package body. The intermediary enables complete filling without direct modification of the molding compound or components.
3Volume of stationary object
If molding compound is injected under pressure, then the spaces are filled, but the upper surface of the package body becomes non-uniform with ripples
Solution Approach 1:
The release sheet serves as a mediator that distributes the injection pressure uniformly across the molding compound. By placing the rigid release sheet over the components before injection, the pressure is applied evenly through the sheet rather than creating localized high-pressure zones that cause ripples. The sheet is removed after curing, leaving a smooth, uniform surface while maintaining complete space filling.
4Manufacturing precision
If a complex molding system is used to prevent component displacement, then component alignment is maintained, but the manufacturing cost increases
Solution Approach 1:
The patent employs a cheap, disposable release sheet that is attached to the molding compound and then discarded after use. This simple, low-cost component prevents component displacement during injection without requiring expensive complex molding systems. The release sheet is a temporary, single-use element that solves the alignment problem economically.
5Reliability
If high aspect ratio spaces are filled with molding compound, then complete encapsulation is achieved, but the process becomes complex and costly
Solution Approach 1:
The release sheet provides a simple, low-cost method to achieve complete encapsulation of high aspect ratio spaces. By using this disposable sheet to guide molding compound flow, the process avoids complex multi-step molding operations or specialized equipment. The sheet is removed after curing, leaving complete encapsulation without complex process requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents component displacement and void formation, achieving reliable filling of high aspect ratio spaces and reducing costs by ensuring a void-free, planar package body with a low-cost lamination process.
Implementation Method 1
A dielectric sheet is laminated around the electronic components thus filling the spaces and forming a package body
Data Source
AI summary
A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist between the electronic components. A dielectric sheet is laminated around the electronic components thus filling the spaces and forming a package body. The spaces are completely and reliably filled by the dielectric sheet and thus the package body has an absence of voids. Further, an upper surface of the package body is planar, i.e., has an absence of ripples or other non-uniformities. Further, lamination of the dielectric sheet is performed with a low cost lamination system.