Dielectric Sheet Temperature Measurement via Threaded Coupling
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Solution Overview
Problem
Current substrate processing apparatuses face challenges in accurately measuring the temperature of dielectric sheets during semiconductor manufacturing, which affects the reliability and precision of the etching process, especially with the miniaturization of semiconductor devices, where temperature control is critical for maintaining pattern dimensions and profile accuracy.
Innovation Solution
A substrate processing apparatus with a temperature measurement unit that includes a screw portion with thread helices meshed with the dielectric sheet's insertion hole, allowing for stable and accurate temperature measurement by being inserted to a depth of 80% or less of the sheet's thickness, with a ceramic film wrapping the measurement unit for protection and thermal compatibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature measurement unit is placed on the dielectric sheet, then temperature measurement capability is improved, but coupling stability and measurement accuracy deteriorate due to loose fitting
Solution Approach 1:
The invention changes the geometric parameters of both the insertion hole and screw portion by adding thread helixes, transforming a simple insertion interface into a threaded coupling interface. This parameter modification enables self-tapping engagement that provides reliable mechanical coupling and stable thermal contact between the measurement unit and dielectric sheet.
Solution Approach 2:
The thread helixes create a spiral/curved engagement path rather than a straight linear insertion. This curved geometry allows the screw portion to progressively engage with the dielectric sheet material, distributing stress and creating a more stable coupling compared to direct linear insertion.
2Strength
If the screw portion is inserted deeply into the dielectric sheet, then coupling strength is improved, but the risk of sheet damage and measurement accuracy deterioration increases
Solution Approach 1:
The invention uses partial action by limiting the insertion depth to 80% or less of the dielectric sheet thickness. The threaded engagement provides sufficient coupling strength without requiring full penetration, thereby avoiding damage to the substrate processing region and maintaining manufacturing precision.
Solution Approach 2:
By modifying the insertion hole to include thread helixes, the invention changes the engagement mechanism from friction-based to thread-based coupling. This allows achieving adequate coupling force with reduced insertion depth, preventing damage to the dielectric sheet and substrate while maintaining measurement accuracy.
3Ease of operation
If the temperature measurement unit is loosely coupled to the dielectric sheet, then assembly ease is improved, but measurement reliability and reproducibility deteriorate
Solution Approach 1:
The addition of thread helixes to both the insertion hole and screw portion transforms the assembly process into a self-tapping operation. The threads guide the insertion and create engagement automatically, providing both ease of assembly through self-alignment and reliable coupling through threaded engagement.
Solution Approach 2:
The threaded interface enables self-tapping engagement where the screw portion automatically creates its own engagement path in the dielectric sheet during insertion. This self-service mechanism ensures consistent coupling without requiring precise pre-alignment or additional fastening steps, improving both assembly ease and measurement reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability of temperature measurement by stabilizing the coupling between the measurement unit and the dielectric sheet, reducing external interference, and improving the accuracy of temperature readings, thereby ensuring consistent and precise substrate processing.
Implementation Method 1
each of the insertion hole and the screw portion has thread helixes meshed with each other
Implementation Method 2
a temperature measurement unit that is disposed on the dielectric sheet to measure the temperature of the dielectric sheet
Implementation Method 3
a ceramic film wrapping the measurement unit for protection and thermal compatibility
Data Source
AI summary
Provided are substrate processing apparatuses including a temperature measurement unit. The substrate processing apparatus comprises a chamber including a substrate processing region, a dielectric sheet that is disposed on the substrate processing region and includes an insertion hole and a temperature measurement unit that is disposed on the dielectric sheet to measure the temperature of the dielectric sheet, and has a screw portion inserted into the insertion hole, wherein each of the insertion hole and the screw portion has thread helixes meshed with each other.