Dielectric Waveguide Connection Structure with Segmented Choke Passages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing connection structures for dielectric waveguides suffer from leakage of electromagnetic waves due to misalignment and thickness errors in adhesive layers, leading to deteriorated high-frequency transmission characteristics and increased substrate area, making it difficult to maintain optimal choke passage lengths and vias arrangement.
Innovation Solution
A connection structure featuring multi-layer dielectric substrates with surface-layer and inner-layer conductors, and conductor columns forming choke passages of specific lengths to optimize electrical lengths and vias arrangement in a staggered pattern, reducing wave leakage and improving reflection and passage characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a dielectric adhesive is applied between dielectric substrates to fix them, then the substrates are securely connected, but the electrical length of choke passages becomes inaccurate due to thickness errors and misalignment, deteriorating transmission characteristics
Solution Approach 1:
The choke passage is divided into two independent segments: a first choke passage formed in the first dielectric substrate and a second choke passage formed in the second dielectric substrate. Each segment has an independent electrical length requirement (λe'/4 and λe/4 respectively). This segmentation allows each substrate to be manufactured and assembled independently without requiring precise control of the adhesive layer thickness, as the total electrical length is the sum of the two independent segments.
Solution Approach 2:
The invention changes the electrical length parameters of the choke passages from a single continuous passage requiring precise thickness control to two separate passages with independently optimized lengths. The first choke passage has electrical length λe'/4 and the second has electrical length λe/4, where these parameters can be independently adjusted during substrate design without being affected by adhesive layer variations.
2Reliability
If choke structures are formed to suppress electromagnetic wave leakage from gaps, then transmission characteristics improve, but the substrate area increases making the structure non-compact
Solution Approach 1:
The invention utilizes the thickness dimension (laminating direction) to create effective choke passages by forming conductor removed portions that extend through the substrate thickness. This allows the choke structures to achieve their electromagnetic shielding function primarily in the vertical dimension rather than requiring large lateral extensions, thereby maintaining substrate compactness while effectively suppressing wave leakage.
3Reliability
If the electrical length of choke passages is optimized for minimal wave leakage, then transmission characteristics improve, but the structure becomes complex and difficult to manufacture
Solution Approach 1:
The complex choke structure is segmented into two simpler independent passages formed in separate substrates. Each passage follows a standard λe/4 design that can be independently optimized and manufactured using conventional techniques, avoiding the need for complex multi-layer integration or precise three-dimensional positioning that would result from a single continuous choke passage design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact, laminated structure with enhanced reflection and passage characteristics for high-frequency signals by optimizing choke structures and vias arrangement, suppressing wave leakage and maintaining effective transmission.
Implementation Method 1
a first choke passage having a length of λ/4... and a second choke passage having a length of λe/4... suppressing wave leakage
Data Source
Figure 1~2
Figure 3
Figure 4A~4B
AI summary
Provided is a structure configured to electrically connect multi-layer dielectric waveguides, each including a dielectric waveguide formed of conductor patterns and vias in a laminating direction of the multi-layer dielectric substrate, in which the vias for forming part of a waveguide wall of each of the dielectric waveguides are arranged in a staggered pattern in the multi-layer dielectric substrate side having choke structures formed so as to electrically connect the waveguides to each other.