Dielectric Carrier Waveguide Transition for Surface-Mounted Microwave Routing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing surface-mounted waveguide structures face mechanical stress and assembly challenges due to differing thermal expansion coefficients and are too large for automated production, with current solutions being complex and prone to signal leakage and mismatch.
Innovation Solution
A waveguide transition arrangement where the dielectric carrier material acts as a waveguide transition between surface-mounted waveguide parts, using apertures enclosed by via holes to connect the parts without disrupting signal transmission, with 90° bend parts and transformer sections for efficient signal routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If large mechanical waveguide components are surface-mounted on dielectric carrier material, then integration density is improved, but mechanical stress and assembly complexity increase due to different coefficients of thermal expansion
Solution Approach 1:
The waveguide structure is divided into multiple separate surface-mountable waveguide parts that are individually mounted on the dielectric carrier material. Each part can be independently manufactured and assembled, reducing the overall complexity of handling large mechanical components while maintaining integration density.
Solution Approach 2:
A transition arrangement with apertures enclosed by via holes is introduced as an intermediary structure to connect adjacent surface-mounted waveguide parts. This transition arrangement facilitates signal transmission between waveguide parts while accommodating thermal expansion differences, thereby reducing mechanical stress and assembly complexity.
2Reliability
If surface-mounted waveguide parts are connected through openings in dielectric carrier material, then signal transmission is achieved, but signal leakage and mismatch increase
Solution Approach 1:
The via holes are arranged to enclose the apertures, creating a nested structure where the via holes form a frame around the signal transmission path. This nested configuration provides electromagnetic shielding that prevents signal leakage while maintaining signal transmission through the dielectric carrier material.
Solution Approach 2:
The transition arrangement features locally optimized structures at the aperture regions, including specifically positioned via holes and shaped apertures, that enhance signal transmission while minimizing leakage. The local quality of the electromagnetic field is improved at critical interfaces between waveguide parts.
3Area of stationary object
If waveguide parts are positioned close to each other, then area utilization is improved, but signal leakage and mismatch due to small gaps increase
Solution Approach 1:
The via holes enclose the apertures in a nested configuration that provides electromagnetic shielding even when waveguide parts are positioned close together. This allows maximum area utilization while preventing signal leakage through the small gaps between adjacent waveguide parts.
4Reliability
If complex transition arrangements with multiple components are used to connect waveguide parts, then signal transmission is achieved, but manufacturing complexity and production cost increase
Solution Approach 1:
The transition arrangement integrates multiple functions into a single compact structure that combines apertures for signal transmission with enclosing via holes for shielding and mechanical support. This merged structure simplifies manufacturing compared to using separate components for each function, while maintaining reliable signal transmission between waveguide parts.
Data Source
Figure 1
Figure 2a~2b
Figure 3a~4
AI summary
The present invention relates to a transition arrangement comprising two surface-mountable waveguide parts (4, 5) and a dielectric carrier material (1) with a metalization (M) and a ground plane (G) provide on a respective first main side (2) and second main side (3), the surface-mountable waveguide parts (4, 5) each comprising a first wall (7, 10), a second wall (8, 11), and a third wall (9, 12), which second and third walls (8, 9; 11, 12) are arranged to contact a part of the metalization (M), all the walls (7, 8, 9) together essentially forming a U-shape, the surface-mountable waveguide parts (4, 5) also comprising respective bend parts (20, 21). The metalization (M) on the first main side (2) is removed such that a first aperture (17) and a second aperture (18) are formed, the apertures (17, 18) being enclosed by a frame of via holes (19) electrically connecting the ground plane (G) with the metalization (M), the bend parts (20, 21) being fitted such that the apertures (17, 18) permit passage of a microwave signal propagating via the bend parts (20, 21). Then the dielectric carrier material (1) itself acts as a waveguide transition between the first aperture (17) and the second aperture (18).