Printed Circuit Details TRIZ Cases
- Multi-Layer Touch Sensors for Flexible Displays
Segmented dual-layer touch sensors prevent electrode breakage during bending, extending lifespan while overlapping wires minimize space usage.
- Flexible Wiring Substrate Seal Structure with Projected Portions
Projected portions on flexible wiring substrate expand seal member width to suppress deformation during insertion and maintain uniform surface pressure.
- Integrated Substrate Shielding for Electronic Units
Integral substrate elevation blocks electromagnetic radiation between components, reducing manufacturing complexity and costs.
- Mobile Terminal Side Case Single Slit Antenna Design
A mobile terminal side case features a single slit with spaced end portions to function as an antenna radiator.
- Electronic Panel Organic Inorganic Insulation Layer Structure
An electronic panel structure uses an inorganic insulation layer to protect underlying organic insulation layers during manufacturing.
- LED Composite Substrate Penetrating Electrodes Eliminate Connectors
Composite substrate with penetrating electrodes connects directly to printed circuit boards, eliminating expensive connectors and reducing manufacturing costs.
- Optical Backplane Fiber Orientation for High Density Mounting
Orient optical fibers nonparallel to circuit substrate surfaces to eliminate bending radius constraints and increase mounting density.
- Circuit Driving Element Crack Prevention Layer for Flexible Displays
A circuit driving element integrates a protective layer covering the entire top surface of the driving chip to withstand bending stresses.
- Actuator Control Bus Bar Orientation for Mold Release Interference
Bus bar orientation differs from mold release direction to prevent resin molding interference and reduce manufacturing costs.
- Flexible Printed Wiring Board Fixing for LCD Thickness Reduction
Segmented adhesive tape secures flexible printed wiring boards to backlight frames.
- Dual Pump Heat Exchange Device for Liquid Cooling Flow Speed
Segmenting pumping functions into driving and circulation units increases cooling liquid flow speed to resolve slow cyclic flow bottlenecks.
- PCM Heatsink Slots for Munition Thermal Management
Segmented heatsink plate slots contain phase change material to absorb heat, protecting sensitive electronics from thermal stress in guided munitions.
- High-Frequency Transmission Line Member With Local Ground Conductor
Selective ground conductor placement reduces transmission line thickness without increasing capacitance or transmission loss in the first portion.
- Wiring Board Inner Metal Layer Thermal Stress Reduction
An inner metal layer extends perpendicularly through the insulating substrate to disperse thermal stress and prevent warping.
- Vertical Trench Routing for Extended High-Speed Channel Length
Vertical trench routing extends differential signal conductors into substrate layers, reducing PCB loss and eliminating retimers for high-speed serial I/O.