LED Composite Substrate Penetrating Electrodes Eliminate Connectors
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Solution Overview
Problem
Conventional LED modules with chip on board (COB) substrates require expensive connectors, increasing the overall cost due to the limited configuration of electrodes on the front side of the substrate.
Innovation Solution
A composite substrate for light emitting devices featuring a metal substrate, an insulating carrier, and an electrode where the electrode penetrates the insulating carrier, allowing electrical connection to the printed circuit board without the need for a separate connector, utilizing a copper substrate for efficient thermal management and incorporating waterproof and roughening structures for enhanced stability and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrodes are only disposed on the front side of the COB substrate to reduce welding abnormality, then welding reliability is improved, but the device requires expensive connectors which increases overall cost
Solution Approach 1:
The patent extends the electrode configuration from a single-plane (front side only) arrangement to a multi-dimensional structure where electrodes are disposed on both the front side and back side of the COB substrate. This dimensional expansion allows direct electrical connection to the printed circuit board without requiring additional connectors, thereby reducing device complexity and cost while maintaining welding reliability through the front-side electrode configuration.
Solution Approach 2:
The COB substrate is designed to serve multiple functions simultaneously: it acts as both the mounting platform for LED chips and as the electrical connection interface itself. By incorporating electrodes on both sides of the substrate, the COB substrate becomes a multi-functional component that provides both mechanical support and electrical connectivity, eliminating the need for separate connector components.
2Reliability
If connectors are used to achieve electrical connection between COB substrate and printed circuit board, then electrical connectivity is ensured, but the cost of LED module increases
Solution Approach 1:
The patent merges the electrical connection function previously performed by separate connectors directly into the COB substrate structure. By disposing electrodes on both the front and back sides of the COB substrate, the substrate itself becomes the electrical connection interface, eliminating the need for additional connector components and reducing manufacturing cost while ensuring reliable electrical connectivity to the printed circuit board.
Solution Approach 2:
The connector component is extracted and removed from the LED module assembly. The electrical connection function that was previously performed by a separate connector is now directly integrated into the COB substrate through its dual-side electrode configuration, simplifying the overall structure and reducing cost.
3Ease of manufacture
If the back side of electrode and metal substrate are at the same height level, then manufacturing is simplified, but thermal management and waterproofing effectiveness are reduced
Solution Approach 1:
The patent applies different height levels to different regions of the substrate structure. Specifically, the back side of the electrode and metal substrate are positioned at different height levels (with a height difference of 0.01-0.5mm) to create localized functional zones: one optimized for thermal management and waterproofing, and another for electrical connection. This local differentiation improves thermal management effectiveness and waterproofing while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces costs by eliminating the need for connectors and enhances thermal management and light utilization through efficient heat dissipation and light reflection, while maintaining electrical and thermal connectivity.
Implementation Method 1
the heat sink is disposed below the COB substrate, which is used for dissipating thermal that generates from the light emitting of the LED chip
Implementation Method 2
the insulating carrier forms a waterproof structure close to the bottom of the metal substrate, the waterproof structure is a waterproof groove
Data Source
AI summary
The invention relates to a composite substrate for light emitting device and a LED module equipped with the composite substrate for light emitting device. The composite substrate for light emitting device includes a metal substrate, an insulating carrier and an electrode, the metal substrate and the insulating carrier respectively have a front side and a back side that are opposite, the insulating carrier is disposed on the periphery of the metal substrate and connected to the metal substrate, the electrode is disposed on the insulating carrier, the electrode penetrates the insulating carrier, the electrode has a front side and a back side that are opposite, the heights of the back sides of the insulating carrier and the electrode are less than that of the back side of the metal substrate. The present invention also provides a LED module. The composite substrate for light emitting device can reduce costs.