Electronic Panel Organic Inorganic Insulation Layer Structure
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Solution Overview
Problem
Flexible or bendable electronic devices with organic insulation layers face challenges in chemical resistance and process reliability during manufacturing, as these materials are prone to damage during chemical etching processes.
Innovation Solution
The implementation of a structure with an organic insulation layer sandwiched between conductive layers, where an inorganic insulation layer covers the organic layer and exposes specific surfaces, enhancing chemical resistance and process reliability by protecting the organic layer from damage during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an organic insulation layer is used to facilitate flexibility in bendable electronic devices, then flexibility is improved, but chemical resistance deteriorates causing damage during manufacturing processes
Solution Approach 1:
The patent combines organic insulation layers with inorganic insulation layers to create a composite structure. The organic layer provides flexibility while the inorganic layer provides chemical resistance, resolving the contradiction between these two properties.
Solution Approach 2:
The inorganic insulation layer acts as a protective intermediary between the organic insulation layer and the chemical etching environment. It shields the organic layer from chemical damage while allowing the organic layer to maintain its flexibility function.
2Adaptability or versatility
If an organic insulation layer is used to enable bendable device functionality, then device adaptability is improved, but manufacturing precision deteriorates due to material damage during etching
Solution Approach 1:
The composite structure of organic and inorganic insulation layers allows the device to achieve bendable functionality while the inorganic layer ensures manufacturing precision by protecting against etching damage.
Solution Approach 2:
The inorganic insulation layer is formed beforehand to provide protective coverage over the organic insulation layer before chemical etching processes occur, preventing damage in advance.
3Reliability
If the organic insulation layer is covered completely by inorganic insulation layer, then chemical resistance is improved, but device complexity increases
Solution Approach 1:
The inorganic insulation layer is selectively formed to cover only specific regions of the organic insulation layer where chemical protection is needed, rather than covering the entire surface uniformly. This reduces unnecessary complexity while maintaining chemical resistance where required.
Data Source
AI summary
An electronic device includes an electronic panel having an active area and a pad area, the electronic panel including a sensing unit responsive to external input, and a circuit board connected to the electronic panel in the pad area, in which the electronic panel includes a first conductive layer disposed on the active area, a second conductive layer disposed on the first conductive layer, an organic insulation layer disposed between the first conductive layer and the second conductive layer, and an inorganic insulation layer covering a first surface of the organic insulation layer and exposing a first surface of the second conductive layer.