Optical Backplane Fiber Orientation for High Density Mounting

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Solution Overview

Problem

Conventional optical backplane structures face limitations in increasing mounting density due to the need to bypass connectors, which restricts the reduction of mounting intervals between boards and limits the information processing capacity of equipment.

Innovation Solution

The proposed solution involves orienting optical fibers and connectors at nonparallel angles to the main surface of the circuit substrate and optical backplane, allowing for reduced bending and increased density by eliminating the need for connector bypasses, with photoelectric conversion modules and connectors disposed to accommodate optical fibers in a juxtaposed state.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If optical fibers are laid to overlap a connector portion on optical backplane, then connector attachment is difficult, but optical fibers must be bent twice creating lower limit in bending radius

Engineering Contradiction:

Improveconnector attachmentVSAvoidfiber bending radius

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent inverts the conventional approach by having optical fibers extend parallel to the optical backplane surface rather than perpendicular. This inversion eliminates the need for fibers to overlap and bend around connectors, as connectors are now attached to the side surfaces of the backplane where fibers pass by in parallel, resolving both the attachment difficulty and bending radius constraints

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent transitions from a conventional perpendicular fiber arrangement (one dimension) to a parallel arrangement where fibers extend along the surface of the backplane (adding a second dimensional aspect). This dimensional change allows connectors to be positioned on side surfaces without interfering with fiber paths, eliminating the need for fiber bending and enabling precise connector attachment

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If optical fibers are bent twice in vertically standing-up portion and bypass portion, then fiber bending radius lower limit is imposed, but mounting interval between boards cannot be reduced to less than 45 mm

Engineering Contradiction:

Improvefiber bending radiusVSAvoidmounting interval

Core Design Contradiction:

ReliabilityVSLength of moving object

Solution Approach 1:

The patent inverts the conventional perpendicular fiber arrangement to a parallel configuration where fibers extend along the backplane surface. This eliminates the two bending points (vertical portion and bypass portion) that impose the 45 mm minimum interval, allowing boards to be mounted closer together while maintaining fiber reliability

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent extracts the bending operations from the fiber path by redirecting fibers to run parallel to the backplane surface. This removes the harmful bending effects and their associated minimum interval constraints, enabling reduced mounting intervals between boards while preserving fiber reliability

Inventive Principle:

Principle #2Taking out (Extraction)

3Shape

If optical fibers are disposed in parallel with board surface, then connector bypass is necessary, but mounting density of optical backplane cannot be increased

Engineering Contradiction:

Improvefiber disposing directionVSAvoidmounting density

Core Design Contradiction:

ShapeVSQuantity of substance

Solution Approach 1:

The patent inverts the conventional approach by disposing optical fibers parallel to the backplane surface rather than perpendicular. This inversion eliminates the need for connector bypass operations, allowing connectors to be attached directly to side surfaces and enabling increased mounting density of the optical backplane

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the mounting density of both circuit substrates and optical backplanes, enabling a higher number of connections and increased information processing capacity without the constraints of traditional bending limitations.

Implementation Method 1

a plurality of first optical fibers...connected to the photoelectric conversion module...and disposed to an edge portion of the circuit substrate

Methodology Applied

Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS7585119B2Optical connection structure between optical backplane and circuit substrate

Publication Date: 2009.09.08 NEC CORP

AI summary

Information processing equipment includes a photoelectric conversion module disposed on a circuit substrate, a first optical connector connected to the photoelectric conversion module through a plurality of first optical fibers and disposed to an edge portion of the circuit substrate, and a second optical connector disposed on an optical backplane and optically connected to the first optical connector. The disposing direction of the optical fibers in the photoelectric conversion module is in nonparallel with the main surface of the circuit substrate and the disposing direction of the optical fibers in the first optical connector and the disposing direction of the optical fibers in the second optical connector are in nonparallel with the main surface of the circuit substrate.