Integrated Substrate Shielding for Electronic Units
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Solution Overview
Problem
Existing electronic units face challenges in compactly and cost-effectively shielding electromagnetic radiation between components, as conventional shielding methods are complex and expensive.
Innovation Solution
A one-piece substrate elevation is used as a shielding barrier, formed from the substrate material, which extends between electronic components to prevent direct radiation impact, and can be produced through processes like etching, milling, laser ablation, or 3D printing, reducing manufacturing complexity and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conventional shield is placed between electronic components to prevent electromagnetic radiation, then radiation shielding effectiveness is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the shielding function with the substrate by forming the shield as an integral raised element of the substrate itself. This eliminates the need for separate shielding components and their associated mounting structures, thereby reducing device complexity while maintaining radiation shielding effectiveness.
Solution Approach 2:
The substrate is designed to serve multiple functions: it provides mechanical support for electronic components and simultaneously acts as an electromagnetic radiation shield through its raised element. This multi-functionality eliminates the need for dedicated shielding structures, reducing overall device complexity.
2Object-affected harmful factors
If a conventional shield is placed between electronic components to prevent electromagnetic radiation, then radiation shielding effectiveness is improved, but manufacturing cost increases
Solution Approach 1:
The shielding function is combined with the substrate manufacturing process. The raised element is formed as an integral part of the substrate, eliminating the need for separate shielding component fabrication, procurement, and assembly operations, thereby reducing manufacturing cost.
Solution Approach 2:
The shield is formed during the substrate manufacturing process itself, before components are mounted. This preliminary formation of the shielding structure eliminates subsequent assembly steps and reduces overall manufacturing complexity and cost.
3Length of stationary object
If the overall height of the electronic unit is reduced for compact design, then device compactness is improved, but shielding effectiveness may be compromised
Solution Approach 1:
The patent addresses the height constraint by extending the shield laterally in the horizontal plane rather than increasing vertical height. The raised element creates a lateral barrier that effectively blocks electromagnetic radiation paths between components while maintaining a compact overall height profile.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides effective radiation shielding while minimizing the overall height of the electronic unit and reducing production costs by integrating the shielding into the substrate, ensuring reliable protection of sensitive components like sensors.
Implementation Method 1
the raised element thus constitutes a shielding barrier for the radiation
Implementation Method 2
material from the substrate around the raised area is removed from a blank, e.g., by etching, milling and/or laser ablation
Data Source
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AI summary
The present invention relates to an electronic unit comprising at least a first electronic component and a second electronic component, which are mounted on a substrate. Between the first and the second electric component a shielding is arranged, which comprises a raised portion that protrudes from a plane defined by the substrate or extends from the surface of said substrate and acts as a shielding, the raised portion being formed integrally with the substrate.