Dielectric Waveguide Surface Mounting via Wrap-Around Openings
Solution Overview
Problem
Dielectric waveguide devices with center conductor pins require connectors that cannot be surface-mounted without cables, limiting their integration with printed circuit boards.
Innovation Solution
The design incorporates a block-shaped dielectric waveguide with a conductive coating and wrap-around openings at the edges, allowing for surface-mounting on a substrate without raised connection features, enabling direct electrical contact through wrap-around slots and grounding traces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If dielectric waveguide devices use center conductor pins with connectors, then electrical connection is achieved, but the device cannot be surface-mounted without cables
Solution Approach 1:
The patent removes the center conductor pins and traditional connectors from the dielectric waveguide device, extracting the problematic connection mechanism that prevented surface-mounting. Instead, it uses wrap-around openings at the edges of the dielectric block that directly contact signal and ground traces on the substrate, eliminating the need for cables and complex connectors while enabling true surface-mount installation
Solution Approach 2:
The patent transitions from a traditional three-dimensional connector assembly requiring vertical space and cable routing to a two-dimensional wrap-around opening configuration that lies flat against the substrate surface. This dimensional change allows the device to be mounted directly on the circuit board plane without protruding connection features, achieving true surface-mount capability
2Ease of manufacture
If traditional connectors are used, then electrical connection is established, but costs increase and integration with printed circuit boards is limited
Solution Approach 1:
The patent merges the dielectric block structure with the connection mechanism by integrating wrap-around openings directly into the edges of the dielectric block itself. This combines the waveguide body and connection interface into a single unified structure, eliminating the need for separate connectors and cables, thereby simplifying manufacturing and improving integration with printed circuit boards
Solution Approach 2:
The wrap-around openings serve multiple functions simultaneously: they provide electrical connection for both signal and ground traces, enable surface-mounting capability, and eliminate the need for separate connector components. This multi-functionality reduces overall device complexity and simplifies the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration eliminates the need for connectors, reduces costs, and facilitates true surface-mounting of dielectric waveguide devices on printed circuit boards, improving integration and reducing complexity in RF applications.
Implementation Method 1
a signal can be routed and/or processed between two nodes... facilitated by a radio-frequency waveguide
Implementation Method 2
Dielectric-filled surface-mounted waveguide devices
Data Source
Figure 1~3
Figure 4~5B
Figure 5C~5E
AI summary
Dielectric-filled surface-mounted waveguide devices and methods for coupling microwave energy. In some embodiments, a radio-frequency (RF) waveguide can include a dielectric block having a first edge that joins a mounting surface and a first adjacent surface. The RF waveguide can further include a conductive coating that substantially covers the dielectric block. The conductive coating can define a wrap-around opening that exposes the dielectric block along the first edge. The wrap-around opening can include a strip on the first adjacent surface along the first edge and a strip on the mounting surface along the first edge.