Printed Circuits TRIZ Cases
- Display Device Back Plate Layer Thickness Reduction
Integrating the buffer and light-shielding layers into one component reduces display device thickness while maintaining structural integrity.
- Display Module Flat Area Circuit Board Alignment
A display module uses a flat circuit board area for the substrate and a non-flat periphery for components.
- Turbulent Gas Injection for Wave Soldering Temperature Stability
Segmented secondary pipes inject turbulent gas into the solder bath to improve heat exchange and maintain pool temperature.
- Curved Surface Adjustment Mechanism for TV Backlight
A curved surface adjustment mechanism uses a sliding block and link to switch a backlight backplate between flat and curved states.
- Segmented Support Films for Foldable Display Crack Resistance
Segmented support films with distinct material properties resolve the trade-off between foldability and environmental reliability in flexible displays.