Printed Circuits TRIZ Cases

Integrating the buffer and light-shielding layers into one component reduces display device thickness while maintaining structural integrity.

A display module uses a flat circuit board area for the substrate and a non-flat periphery for components.

Segmented secondary pipes inject turbulent gas into the solder bath to improve heat exchange and maintain pool temperature.

A curved surface adjustment mechanism uses a sliding block and link to switch a backlight backplate between flat and curved states.

Segmented support films with distinct material properties resolve the trade-off between foldability and environmental reliability in flexible displays.

Wrap-around openings in a coated dielectric block eliminate center conductor pins, enabling true surface mounting without cables or complex connectors.

An inverted housing tilt mechanism compensates for hand shake by rotating the support plate, eliminating the need for large lens diameters that cause blur.

Segmented bushing design allows post-installation assembly on wired connectors, eliminating hazardous wire disconnection required by code compliance.

A resin composition incorporates an aromatic-alicyclic copolymer to reduce dielectric constant while raising glass transition temperature above 220°C.

Merging separate circuit boards into a single flexible unit reduces device weight and thickness while maintaining reliable signal transmission.

A laser processing device adjusts condensing shape via a spatial light modulator to optimize fracture extension during material dicing.

Conductive mounting pins connect the PCB to a grounded shell, containing electromagnetic interference while preserving usable surface area.

Segmenting the connector into a reflow-compatible header and a post-soldered attachment resolves material compatibility constraints.

A detachable external terminal connects to a bus bar inside an electric distribution box.

Adjacent conductive and non-conductive members prevent short circuits between closely spaced pad electrodes and bumps in high-resolution displays.

Ultrasonic writing head deposits flux-free solder paste to create rectangular wetting patterns, eliminating side wall obstruction from custom dies.

A polymer composite blends low and high molecular weight styrene copolymers to form a resin with a dielectric loss tangent of 0.002 or less.