Styrene Copolymer Composite for Low Dielectric Loss Resin

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Solution Overview

Problem

High-frequency 5G mobile network technology faces challenges with signal transmission and reception due to high-frequency path loss, conductor loss, and dielectric loss, necessitating the development of copper clad laminate (CCL) materials with low dielectric loss.

Innovation Solution

A polymer composite is developed, comprising a first styrene-based copolymer with a weight average molecular weight less than 20,000 g/mol and a second styrene-based copolymer with a weight average molecular weight greater than 20,000 g/mol, with a weight ratio between 5/95 and 95/5, to create a low dielectric resin composition with a dielectric loss tangent (Df) of less than or equal to 0.00200.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a resin composition is developed to reduce dielectric loss, then dielectric loss is reduced, but processability and fluidity deteriorate

Engineering Contradiction:

Improvedielectric lossVSAvoidprocessability

Core Design Contradiction:

Loss of energyVSEase of manufacture

Solution Approach 1:

The patent changes the molecular weight parameters of the styrene-based copolymer, using a specific range (5,000-80,000 g/mol) to optimize both dielectric loss and processability. This parameter optimization allows the resin to achieve low dielectric loss while maintaining adequate fluidity and processing performance

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite resin system combining styrene-based copolymer with other components in specific ratios. This composite approach allows the mixture to achieve properties that individual components cannot provide alone, balancing low dielectric loss with good processability

Inventive Principle:

Principle #40Composite materials

2Loss of energy

If a resin composition is developed to reduce dielectric loss, then dielectric loss is reduced, but flowability deteriorates

Engineering Contradiction:

Improvedielectric lossVSAvoidflowability

Core Design Contradiction:

Loss of energyVSProductivity

Solution Approach 1:

The patent optimizes the molecular weight parameter of the styrene-based copolymer to a specific range (5,000-80,000 g/mol) that simultaneously achieves low dielectric loss and adequate flowability. This parameter control ensures the resin flows sufficiently during processing while maintaining low dielectric properties

Inventive Principle:

Principle #35Parameter changes

3Loss of energy

If a resin composition is developed to reduce dielectric loss, then dielectric loss is reduced, but filling performance deteriorates

Engineering Contradiction:

Improvedielectric lossVSAvoidfilling performance

Core Design Contradiction:

Loss of energyVSManufacturing precision

Solution Approach 1:

The patent controls the molecular weight parameter within 5,000-80,000 g/mol to ensure the resin has appropriate viscosity and flow characteristics. This parameter optimization enables the resin to fill molds completely and uniformly while maintaining low dielectric loss

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS20250122367A1Polymer composite, use thereof, low dielectric resin composition, prepreg, and metal foil laminated board

Publication Date: 2025.04.17 LEE CHANG YUNG CHEM IND CORP

AI summary

A polymer composite for preparing a low dielectric resin composition having a dielectric loss tangent (Df) that is less than or equal to 0.00200 is provided. The polymer composite includes a first styrene-based copolymer having a weight average molecular weight that is lower than 20,000 g/mol and a second styrene-based copolymer having a weight average molecular weight that is higher than 20,000 g/mol, wherein the weight ratio of the first styrene-based copolymer to the second styrene-based copolymer is from 5/95 to 95/5.