Resin Composition for Low Dielectric Circuit Boards

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Solution Overview

Problem

Liquid rubber resin substrates exhibit low glass transition temperature, poor reactivity, poor processability, high melt viscosity, and low peel strength due to their thermosetting nature and limited reactive groups, making it challenging to achieve high-frequency transmission capabilities with low dielectric properties.

Innovation Solution

A resin composition incorporating a copolymer with an aromatic monomer and an alicyclic monomer, having a molecular weight range of 2000 to 5000 and a proportion of alicyclic monomer between 1% to 30%, which forms a non-polar backbone structure, enhancing glass transition temperature and peel strength while maintaining low dielectric properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If liquid rubber resin is used to achieve low dielectric properties, then dielectric performance is improved, but glass transition temperature and peel strength deteriorate

Engineering Contradiction:

Improvedielectric performanceVSAvoidglass transition temperature

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent uses a composite resin composition combining liquid rubber resin with specific copolymers (containing aromatic and alicyclic monomers) to achieve both low dielectric properties and high glass transition temperature. The copolymer components provide structural rigidity while the liquid rubber matrix maintains low dielectric constant, resolving the contradiction between dielectric performance and thermal stability.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent modifies the molecular structure parameters of the resin by controlling the copolymer composition (aromatic monomer 20-90%, alicyclic monomer 1-30%, vinyl 10-40%) and molecular weight (2000-5000) to simultaneously optimize dielectric properties and glass transition temperature. This parameter optimization allows achieving Tg > 220°C while maintaining low Dk and Df values.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If liquid rubber resin is used to achieve low dielectric properties, then dielectric performance is improved, but reactivity and processability deteriorate

Engineering Contradiction:

Improvedielectric performanceVSAvoidprocessability

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines liquid rubber resin with reactive copolymer components that provide functional groups for crosslinking and chemical bonding. This composite structure enhances reactivity and processability while the liquid rubber matrix maintains low dielectric properties, solving the contradiction between dielectric performance and manufacturability.

Inventive Principle:

Principle #40Composite materials

3Reliability

If liquid rubber resin is used to achieve low dielectric properties, then dielectric performance is improved, but melt viscosity deteriorates

Engineering Contradiction:

Improvedielectric performanceVSAvoidmelt viscosity

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent optimizes the molecular weight parameter of the copolymer to the range of 2000-5000, which provides the right balance between viscosity and processability. This parameter control ensures the resin maintains low dielectric properties while having acceptable melt viscosity for manufacturing applications.

Inventive Principle:

Principle #35Parameter changes

4Reliability

If liquid rubber resin is used to achieve low dielectric properties, then dielectric performance is improved, but peel strength deteriorates

Engineering Contradiction:

Improvedielectric performanceVSAvoidpeel strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent creates a composite system where the copolymer components form a robust network within the liquid rubber matrix, enhancing interfacial bonding and peel strength while the overall composition maintains low dielectric constant for high-frequency transmission applications.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resin composition significantly improves glass transition temperature above 220°C, reduces dielectric constant and dissipation factor, and enhances reactivity, heat resistance, and flexibility, while maintaining low dielectric properties, resulting in improved performance for substrates like circuit boards and copper foil substrates.

Implementation Method 1

the copolymer includes an aromatic monomer and an alicyclic monomer... the manufactured substrate thereof has good low dielectric properties

Methodology Applied

Scientific EffectDielectric properties: Dielectric

Implementation Method 2

increases a glass transition temperature... the glass transition temperature above 220°C

Methodology Applied

Scientific EffectGlass transition:

Implementation Method 3

dissolving at least a Lewis acid catalyst, an aromatic compound and an alicyclic compound in a solvent to form a first solution

Methodology Applied

Scientific EffectCatalysis: Catalysis

Implementation Method 4

using an alkali solution to perform a neutralization on the first solution

Methodology Applied

Scientific EffectNeutralization:

Data Source

PatentUS20240400734A1Resin composition and manufacturing method thereof

Publication Date: 2024.12.05 NANYA PLASTICS CORP

AI summary

A resin composition includes a copolymer. The copolymer includes an aromatic monomer and an alicyclic monomer. A molecular weight of the copolymer is in a range of 2000 to 5000. Compared with the copolymer, a proportion of the alicyclic monomer is 1% to 30%. A manufacturing method of the resin composition is also provided.