Two-Piece Connector Assembly for SMT Reflow
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Solution Overview
Problem
In surface mount technology (SMT) processes, there is a challenge in integrating components that are not compatible with reflow soldering, as existing solutions do not provide a reliable method for attaching components that cannot withstand high temperatures during the reflow process while ensuring secure and efficient electrical and mechanical connections.
Innovation Solution
A two-piece connector assembly is introduced, comprising a connector header made from high-temperature resistant materials suitable for reflow soldering and a header attachment assembly made from less expensive materials that are not suitable for reflow soldering, allowing for separate attachment post-soldering. This assembly includes features like mounting sleeves, shoulders, and solder nails for secure mechanical and electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single-piece connector is used for reflow soldering, then the connector can withstand the high temperature process, but components made from less expensive materials that cannot withstand reflow soldering cannot be integrated
Solution Approach 1:
The connector is divided into two separate pieces: a header made from high-temperature resistant material suitable for reflow soldering, and an attachment assembly made from less expensive materials that cannot withstand reflow soldering. This segmentation allows each component to be optimized for its specific material properties and manufacturing requirements, resolving the contradiction between material compatibility and structural complexity.
2Ease of manufacture
If expensive high-temperature resistant materials are used for the entire connector assembly, then reflow soldering is possible, but cost increases
Solution Approach 1:
The header portion of the connector that undergoes reflow soldering is made from expensive high-temperature resistant material, while the attachment assembly portion is made from less expensive materials. This local quality differentiation ensures that expensive materials are used only where necessary for withstanding the soldering process, thereby reducing overall material cost while maintaining manufacturability.
3Device complexity
If the header attachment assembly is attached before reflow soldering, then assembly is simplified, but the attachment assembly materials are damaged by high temperature
Solution Approach 1:
The header is prepared in advance with integrated mounting sleeves and electrical contacts before the attachment assembly is connected. This preliminary preparation allows the attachment assembly to be connected after reflow soldering without exposing it to high temperatures, thereby avoiding thermal damage while maintaining a simplified overall assembly process.
4Quantity of substance
If circuit board density is increased, then more components can be mounted, but reliable connection of temperature-sensitive components becomes more difficult
Solution Approach 1:
The connector is segmented into a header that remains on the circuit board after reflow soldering and an attachment assembly that is connected afterward. This segmentation enables reliable electrical connections to be established during the soldering process while allowing temperature-sensitive components in the attachment assembly to be added later without thermal exposure, thereby maintaining both high component density and connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the use of more expensive materials for critical components and less expensive materials for secondary components, increasing circuit board density and allowing for automated SMT assembly, while ensuring secure and efficient connections without damaging the connector header or attachment assembly.
Implementation Method 1
The connector header, constructed of a material that can withstand the reflow soldering process, is mounted to the surface of a circuit board and soldered with a reflow process
Data Source
AI summary
This disclosure is directed to apparatuses, systems, and methods associated with a connector assembly for use with surface mount technology (SMT). The connector assembly has a connector header configured to be mounted to a circuit board and is constructed of a high-temperature resistant material suitable for use with a reflow soldering process. The connector header includes at least one connector socket and at least one mounting shoulder, and is configured to be coupled to a header attachment assembly. The header attachment assembly comprises at least one connector pin and at least one mounting shoulder, and is configured to be coupled to the connector header. An electronic device, such as a card reader or hard drive, may be connected to the header attachment assembly and thereby to the circuit board. The connector assembly allows for the obstructed view inserting and attaching in a manual or an automated assembly process.