Digital Photomask Die Marking for Reliable Semiconductor Traceability
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Solution Overview
Problem
Current methods for tracing semiconductor dies are unreliable and imprecise, making supply chain forecasting and fault detection challenging due to the complexity of traceability and the inability to identify individual dies accurately.
Innovation Solution
Imprinting a unique identifier, such as a two-dimensional code, on each semiconductor die during the manufacturing process using digital photomasks, which are dynamically controlled to minimize interference with the circuit design and are durable enough to withstand high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If unique identifiers are imprinted on semiconductor dies using traditional methods, then traceability is improved, but the process becomes complex and unreliable
Solution Approach 1:
The patent combines the circuit formation process and unique identifier imprinting into a single photolithography step. The digital photomask simultaneously defines both the circuit pattern and the unique identifier for each die, eliminating the need for separate identification processes and reducing overall system complexity while maintaining reliability.
Solution Approach 2:
The photolithography system is made multi-functional by enabling it to perform both circuit fabrication and unique identifier imprinting in one process. The digital photomask serves dual purposes: defining functional circuits and encoding unique die identifiers, thereby simplifying the manufacturing workflow while ensuring reliable traceability.
2Measurement precision
If unique identifiers are added to each semiconductor die, then individual die identification is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges die identification with the existing circuit fabrication process. By using the same photolithography step and digital photomask to create both circuits and unique identifiers, the system achieves precise individual die identification without adding separate manufacturing steps or increasing process complexity.
3Reliability
If digital photomasks are used to imprint unique identifiers, then traceability and authenticity verification are improved, but the system requires advanced technology infrastructure
Solution Approach 1:
The system uses the existing photolithography infrastructure to imprint unique identifiers, making the identification capability self-contained within the manufacturing process. The digital photomask leverages the plant's current equipment and processes, eliminating the need for separate identification systems or additional technology infrastructure while ensuring authentic die verification.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances traceability and authenticity verification of semiconductor dies, improving supply chain management and quality control by providing a cost-effective, durable, and reliable method for identifying individual dies, reducing the risk of tampering and enhancing regulatory compliance.
Implementation Method 1
receiving the substrate at a photolithography station, the substrate comprising a photosensitive layer and an area for forming a plurality of semiconductor dies; forming a plurality of circuits on the substrate using at least one photolithography mask; imprinting the unique identifier on each semiconductor die on the substrate using at least one digital photomask
Data Source
AI summary
Various systems and methods for imprinting a unique identifier on a semiconductor die are disclosed herein. Example embodiments involve receiving a substrate at a photolithography station, the substrate including a photosensitive layer and an area for forming semiconductor dies, forming circuits on the substrate using a photolithography mask, imprinting a unique identifier on each semiconductor die on the substrate using a digital photomask and removing the substrate containing the semiconductor dies containing the circuits and the unique identifiers from the photolithography station. In some embodiments, each unique identifier is associated with a unique record for recording characteristics of the substrate, of the semiconductor die and of the unique identifier. In some embodiments, the digital photomask includes dynamically-controlled pixels, controllable to define a unique pattern for each unique identifier. In some embodiments, the unique identifier is a two-dimensional code.