Digitizer Intermediate Layer Thermal Deformation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing digitizers face issues with separation between the cover layer and electrode pattern layer, and the uneven pattern of the electrode layer is visible to the user, affecting user comfort and device performance.

Innovation Solution

A digitizer design incorporating a thermally deformable intermediate layer between the electrode pattern layer and the cover layer, along with adhesive layers, to prevent separation and hide the uneven pattern, utilizing materials like polyurethane acrylate and insulative materials for the cover and substrate, and implementing an impact absorbing layer for added protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a cover layer is placed directly on the electrode pattern layer, then the electrode pattern is protected, but the uneven pattern of the electrode layer becomes visible to the user

Engineering Contradiction:

Improveprotection of electrode patternVSAvoidvisibility of uneven pattern

Core Design Contradiction:

ReliabilityVSShape

Solution Approach 1:

An intermediate layer is introduced between the cover layer and the electrode pattern layer. This intermediate layer acts as a mediator that fills the uneven spaces of the electrode pattern, creating a flat upper surface that prevents the pattern from being visible while maintaining protection of the underlying electrode structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The protective structure is divided into multiple segments: the cover layer, the intermediate layer, and the electrode pattern layer. This segmentation allows each layer to perform its specific function - the electrode layer provides electromagnetic resonance functionality, the intermediate layer provides planarization, and the cover layer provides protection.

Inventive Principle:

Principle #1Segmentation

2Device complexity

If the cover layer and electrode pattern layer are bonded directly, then structure is simplified, but separation occurs between the layers

Engineering Contradiction:

Improvestructural simplicityVSAvoidbonding stability

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

An adhesive layer is introduced as an intermediary between the cover layer and the electrode pattern layer. This adhesive layer serves as a mediator that provides strong bonding between the two layers, preventing separation while maintaining the overall structural integrity of the digitizer assembly.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The digitizer employs a composite structure consisting of multiple materials with different properties: the cover layer (transparent protective material), the intermediate layer (filler material with different thermal deformation characteristics), the adhesive layer (bonding material), and the electrode pattern layer (conductive material). This composite approach optimizes both bonding stability and functional performance.

Inventive Principle:

Principle #40Composite materials

3Ease of manufacture

If materials with similar thermal deformation temperatures are used, then material selection is simplified, but separation occurs during thermal processing

Engineering Contradiction:

Improvematerial selection simplicityVSAvoidthermal processing stability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

Different regions of the multi-layer structure use materials with different thermal deformation characteristics. The intermediate layer uses a material with a lower thermal deformation temperature than the cover layer, allowing selective deformation during thermal processing. This local differentiation of material properties enables controlled bonding and planarization during manufacturing while preventing separation.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The thermal deformation temperature parameter is deliberately differentiated between layers. The intermediate layer is designed to deform at a lower temperature than the cover layer, allowing the intermediate layer to be shaped and bonded first, followed by the cover layer. This parameter differentiation enables sequential thermal processing that prevents separation while achieving the desired structure.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents separation between the cover and electrode layers, maintains a flat surface for user interaction, and ensures the electrode pattern is not visible, enhancing user comfort and device reliability.

Implementation Method 1

a first intermediate layer located between the first electrode pattern layer and the first cover layer, the first intermediate layer being thermally deformable at a second thermal deformation temperature or higher, wherein the second thermal deformation temperature is lower than the first thermal deformation temperature

Methodology Applied

Scientific EffectThermal deformation: Thermal Expansion

Data Source

PatentUS11455048B2Digitizer including intermediate and adhesive layers and display device including the same

Publication Date: 2022.09.27 SAMSUNG DISPLAY CO LTD

AI summary

A display device includes a display panel, a touch panel, and a digitizer. The digitizer includes a first electrode pattern layer, a first cover layer that is thermally deformable at a first thermal deformation temperature or higher, and a first intermediate layer located between the first electrode pattern layer and the first cover layer. The first intermediate layer is thermally deformable at a second thermal deformation temperature or higher. The second thermal deformation temperature is lower than the first thermal deformation temperature.