Diode Structure Suppressing Parasitic Current via Transistor Competition

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Solution Overview

Problem

In semiconductor devices, unintended pn junctions and transistors can cause parasitic current, reducing efficiency and leading to issues like latchup, where current is diverted away from the intended path and can cause permanent damage.

Innovation Solution

A diode design that includes a parasitic transistor formed between one terminal and the substrate, with an additional lateral transistor competing to direct current flow, reducing parasitic current by diverting it away from the substrate and into a desired path using highly doped p-type regions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If trench isolation is used to reduce parasitic current, then device reliability is improved, but manufacturing complexity and cost increase

Engineering Contradiction:
Improvedevice reliabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The invention extracts and eliminates the parasitic transistor structure by modifying the doping configuration. Specifically, it removes the unintended pnp transistor formation by adjusting the doping types and concentrations in the drift region and contact structure, thereby taking out the harmful parasitic current path without requiring additional isolation trenches or complex manufacturing steps

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention changes the doping parameters (type, concentration, depth) of the semiconductor regions to suppress parasitic current. By modifying the doping concentration in the drift region and contact structure, the parasitic transistor's gain is reduced below unity, preventing latchup while maintaining standard manufacturing processes

Inventive Principle:
Principle #35Parameter changes

2Device complexity

If parasitic current is allowed to flow, then device complexity is reduced, but device efficiency deteriorates and latchup occurs

Engineering Contradiction:
Improvedevice complexityVSAvoiddevice efficiency
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The invention converts the harmful parasitic current into a beneficial effect by designing the doping structure so that the parasitic transistor's operation actually helps suppress latchup. The modified doping configuration ensures that any parasitic current flow remains controlled and contributes to preventing sustained latchup conditions through inherent negative feedback mechanisms

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The diode design effectively reduces parasitic current flow, enhancing device efficiency and preventing latchup by diverting current into a desired path, thus improving the operational reliability and preventing damage.

Implementation Method 1

a second transistor is formed that competes with the parasitic transistor to direct current flow between the anode terminal and the cathode terminal

Methodology Applied
Scientific EffectTransistor competition effect:

Implementation Method 2

reducing parasitic current by diverting it away from the substrate and into a desired path

Methodology Applied
Scientific EffectCurrent diversion:

Data Source

PatentUS7466004B2Diode structure to suppress parasitic current
Publication Date: 2008.12.16 POLAR SEMICON
  • US7466004B2 patent drawing
  • US7466004B2 patent drawing
  • US7466004B2 patent drawing

AI summary

A diode conducts current between an anode terminal and a cathode terminal. The diode includes a parasitic transistor formed between one of the terminals and the substrate. The diode also includes a second transistor that competes with the parasitic transistor to direct current flow between the anode terminal and the cathode terminal.