Direct Bonding Surface Preparation for Microelectronic Components
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The direct bonding of microelectronic components, particularly capillarity-assisted direct bonding of dies on a substrate, often results in defective bonding due to surface treatments using nitrogen plasma or UV ozone, which lead to high defectivity at the bonding interface.
Innovation Solution
A method involving surface treatment of electronic components in a nitrogen atmosphere followed by soaking in an aqueous solution comprising at least 90% water for an extended duration, then drying, to prepare the surfaces for direct bonding, which reduces defects by removing contaminants and improving hydrophilicity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If nitrogen plasma or UV ozone treatment is applied to surfaces before direct bonding, then surface cleanliness is improved, but defectivity at the bonding interface increases
Solution Approach 1:
The patent applies a preliminary aqueous solution treatment (soaking or spraying) to the die surface after nitrogen plasma or UV ozone treatment, before the actual direct bonding process. This intermediate step removes residual nitrogen from the surface, preventing it from causing defects at the bonding interface, while maintaining the surface cleanliness benefits of the initial plasma/ozone treatment.
2Productivity
If capillarity-assisted direct bonding is used to simultaneously bond multiple dies, then productivity is improved, but bonding defectivity increases
Solution Approach 1:
The patent implements a preliminary treatment step where the die surface is soaked or sprayed with an aqueous solution containing at least 90% water for a specific duration (e.g., 30 seconds to 5 minutes) before simultaneous capillarity-assisted bonding. This pre-treatment ensures the surface is free from residual nitrogen that would otherwise cause defects during the high-speed simultaneous bonding process.
Solution Approach 2:
The patent changes the chemical composition and moisture content parameters of the surface by introducing an aqueous solution treatment. This parameter change (adding water to the surface) facilitates better capillarity-driven bonding while removing harmful residual nitrogen, thus improving bonding quality during simultaneous multi-die assembly.
3Reliability
If extended aqueous solution treatment is applied to remove residual nitrogen, then bonding reliability is improved, but processing time increases
Solution Approach 1:
The patent optimizes the treatment parameters by using an aqueous solution with specific composition (at least 90% water, optionally with surfactants or solvents) and controlling the treatment duration (from 30 seconds to 5 minutes for soaking, or shorter for spraying). These parameter adjustments ensure effective nitrogen removal while minimizing the time penalty, achieving a balance between reliability improvement and productivity maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly decreases defectivity at the bonding interface, enhancing the bonding energy and reliability of direct bonding processes by removing residual nitrogen from surface treatments, thus improving the assembly quality of microelectronic components.
Implementation Method 1
the placing into contact of said first surface with an aqueous solution comprising at least 90% of water, for a contacting duration longer than or equal to 30 minutes
Implementation Method 2
a treatment in a nitrogen plasma or a UV ozone treatment
Implementation Method 3
a treatment in a nitrogen plasma or a UV ozone treatment
Implementation Method 4
the drying of said first surface
Implementation Method 5
the drying is a drying by centrifugation
Data Source
AI summary
A method of preparation of a first surface of an electronic component, the first surface being intended to be bonded to another electronic component by a direct bonding and the first surface having previously been submitted to a surface treatment in an atmosphere including nitrogen, for example, a treatment in a nitrogen plasma or an ozone UV treatment, the preparation method including: placing into contact the first surface with an aqueous solution including at least 90% water, for a contacting duration longer than or equal to 30 minutes; and then drying the first surface.