Direct Contact IC Temperature Control Device
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Solution Overview
Problem
Existing methods for controlling IC temperature during testing are inefficient, as they struggle to maintain constant temperatures, especially in extreme conditions, due to indirect heating/cooling methods, lack of precision, and inaccuracy in temperature measurement, which affects the reliability of IC performance tests.
Innovation Solution
A device comprising a compressor with direct contact capabilities, a thermal sensing element, a heat insulating structure, and a temperature controller that allows for precise temperature control and measurement, enabling rapid heating or cooling of ICs to predetermined values, maintaining stability and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If indirect cooling methods (cooling agent applied to socket/PCB) are used, then the IC can be cooled down, but the IC core temperature cannot be quickly lowered and constant temperature cannot be maintained
Solution Approach 1:
The patent introduces a thermal conductor as an intermediary substance that directly contacts both the IC and the cooling agent. This thermal conductor facilitates efficient heat transfer from the IC core to the cooling agent, enabling rapid cooling while maintaining constant temperature control. The thermal conductor acts as a mediator that overcomes the thermal resistance barrier between the IC and indirect cooling methods.
2Temperature
If manual heating methods (hot plate) are used, then the IC can be heated to predetermined temperature, but temperature drops during transfer to socket due to thermal convection and conduction
Solution Approach 1:
The patent combines the heating function and the socket function into a single integrated structure. The socket itself incorporates heating capability, allowing the IC to be heated and tested in the same location without transfer. This eliminates the temperature instability caused by manual transfer between separate heating and testing locations.
Solution Approach 2:
The system performs preliminary heating of the IC within the socket before testing begins. The IC is heated to the predetermined temperature while already positioned in the socket, and the heating continues throughout the testing process to maintain constant temperature. This preliminary action ensures temperature stability is achieved before measurements start.
3Temperature
If heat gun is used for heating, then the IC can be heated, but the temperature cannot be precisely controlled and surrounding components are affected
Solution Approach 1:
The patent implements localized heating directly at the IC location within the socket, rather than using ambient hot air from a heat gun. The heating element is positioned to contact only the IC or immediately surround it, creating a localized thermal zone. This prevents heat from affecting surrounding components while enabling precise temperature control through direct thermal contact and feedback mechanisms.
4Temperature
If thermal stream system is used, then the IC can be heated or cooled, but the system is bulky, consumes a lot of power, and requires compressed gas
Solution Approach 1:
The patent replaces the complex mechanical thermal stream system with a simpler direct thermal contact system. Instead of using compressed gas streams and bulky mechanical components, the invention uses solid thermal conductors that directly contact the IC for heating and cooling. This substitution dramatically reduces power consumption, eliminates the need for compressed gas, and simplifies the overall system structure while maintaining effective temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables rapid and precise temperature control of ICs, reducing testing time and power consumption, while maintaining constant temperatures, thus improving the reliability and efficiency of IC performance tests.
Implementation Method 1
The thermal sensing element is attached to the temperature controlling element
Implementation Method 2
The heat insulating structure is disposed around the temperature controlling element and at least a portion of the compressor
Data Source
AI summary
A device for controlling IC temperature capable of bringing a device-under-test to a predetermined temperature includes a compressor, temperature controller element, thermal sensing element, heat insulating structure, input/output terminal and a temperature controller. The compressor has a base and a contact portion contacting the DUT directly. The thermal sensing element is attached to the temperature controlling element contacting the base. The heat insulation structure surrounds the temperature controlling element and a portion of the compressor. The input/output terminal, having a signal line and at least one power line, is disposed on the heat insulation structure. The power and signal lines connected to the temperature sensor are connected to the temperature controlling element and thermal sensing element respectively. The temperature sensor powers the temperature controlling element and controls temperature thereof. Temperature of the temperature controlling element is obtained by measuring electrical properties of thermal sensing element via signal line.