Electronic Circuit Testing TRIZ Cases

A screening method tracks individual electrolytic capacitor leakage currents to identify unstable units before market release.

A semiconductor integrated circuit uses data registers and comparing units to detect fail paths during test mode.

Embedding a code field with anticipated transit changes allows receivers to verify packet integrity against intermediary device modifications.

Segmenting the debug interface into shared and core-specific controllers resolves single-port bottlenecks, enabling simultaneous multi-core debugging.

A memory programming method divides cells into data and error areas to store residual errors after coarse writing.

A system generates executable system-level tests by solving constraint satisfaction problems derived from user scenarios.

A debugging control system uses inside-core events as trigger conditions to pause and recover clock cycles for scan chain data retrieval.

Shift registers perform linear feedback operations to select cores, reducing design overhead and ATE costs while verifying individual core functionality.

A test system uses a signal selection unit to connect test lines to data or readout paths for separate testing modes.

Dynamic reference voltage adjustment improves measurement precision without increasing circuit structure complexity.

Segmenting magnetic shields into thin layers within the probe card structure reduces interference while maintaining high test throughput.

Multiple independent test stations enable parallel wafer testing to overcome sequential bottlenecks and reduce equipment complexity.

Variable measurement intervals resolve the contradiction between servoing speed and accuracy during continuous power leveling.

A semiconductor MISR uses a clock change-over unit to switch between high-speed storage and low-speed output modes.

A pipelined data processor uses staging storage elements and a multiple input shift register to capture test data from circuit nodes.

A flash memory data structure stores a 512-byte payload and redundant code in adjacent sectors to support stronger error correction.

Copying internal signals to external pads eliminates distortion from direct probing, enabling rapid monitoring without unpackaging.

A circuit board inspection device uses AC voltage and current detection to calculate capacitance and resistance values simultaneously.

Parallel conductive wire members with an insulator reduce wire inductance and surge voltage in inverter circuits by minimizing the current loop area.

Temperature monitor circuit detects operating temperature of memory device during accelerated aging test to prevent overheating damage.

Heaters simulate edge-lit backlight thermal gradients on liquid crystal panels to evaluate gate driver on array circuit performance.

A prober uses a separate probe height detector to adjust the position of a probe position detecting camera for precise wafer electrode alignment.

Elongated directivity probes with transverse slots enable controlled bending for independent operation.

A wafer carrier integrates a test circuit to detect defects during transport between manufacturing stages.

Test apparatus allocates fail conditions to block-level storage using an allocation register.

A clock circuit generates separate core and I/O signals to enable full-speed processor testing.

Diagnostic circuits monitor MEMS actuator voltage to detect control signal faults, reducing system downtime.

A display panel ground line enables electrical testing of voltage, resistance, or current to detect open circuits.

A physical-aware synthesis method generates netlists using extracted parasitic data from placement and routing operations.

Shared clock distribution networks generate aligned scan signals for mixed MuxD and LSSD flip-flops, resolving timing conflicts in unified scan chains.

A test pattern generating circuit synchronizes low-frequency external clocks with high-speed internal signals to produce variable-length patterns.

Segmented thermal head zones with independent heaters and cold plates resolve thermal interference between adjacent components in complex IC packages.

A unified memory BIST controller generates test instructions for single and non-single port memories.

A semiconductor package test apparatus uses a heat transfer member to thermally connect the push block and interface board.

A semiconductor probe contact body receives uniform pressure from segmented electrically-conductive springs to ensure stable surface contact.

Merging work cycle and test data clock signals on shared pins reduces pin count while maintaining JTAG testing capability.

Segmented input and output measurement paths enable rapid detection of open sensors and cross-circuits, resolving latency issues in traditional systems.

A delay test circuit generates output clock pulses by removing optional pulses from an input clock signal to enable at-speed testing.

Plastically deforming straight pins into an arched shape eliminates insulating coatings that obstruct narrow pitch while ensuring reliable fall prevention.

Segmented nanospikes reduce contact force to prevent die damage during wafer testing.

Direct contact heating overcomes slow cooling speeds by merging socket functions to maintain stable temperatures during testing.

A battery system resistor operability check device uses a modulated test current to verify functionality through independent measurement channels.

Dynamic switching of I/O interface circuits enables detection of combinational logics and internal I/O structures without adding scan wrappers.

A detection circuit converts double-ended currents to single-ended voltage signals using multiple current mirrors and resistors.

A computer implemented method illuminates faults in a wiring system by estimating locations and presenting diagrams with indications.

Staggered clock signals applied to segmented scan chains reduce peak power consumption during high-speed scan shift operations.

Vacuum attraction via expandable bellows rigidly integrates the probe card with the wafer chuck before contact.

A semiconductor test apparatus uses an extension board to route signals from a test head to sockets for speed verification.

A grooved holding unit detects semiconductor substrate irregularities using an optical distance sensor for precise position registration.

An mmW absorber in the RF socket reduces cross-coupling between multiple ICs, enabling accurate concurrent testing.