Semiconductor Package Test Apparatus Thermal Control
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Solution Overview
Problem
Existing semiconductor package test apparatuses lack efficient temperature control for both semiconductor packages and interface boards, leading to increased time and reduced precision in temperature adjustment.
Innovation Solution
A semiconductor package test apparatus that includes an interface board with connection terminals, a push block for contacting the semiconductor package, a temperature adjustment unit connected to the push block for heating or cooling the package, and a heat transfer member for thermally connecting the push block and interface board, allowing simultaneous temperature control of both.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If temperature adjustment units are connected only to push blocks for heating or cooling semiconductor packages, then the semiconductor packages can be temperature controlled, but the time required for temperature control increases because the interface board cannot be controlled separately
Solution Approach 1:
The patent merges the temperature control functions by thermally connecting the push block and interface board through a heat transfer member. This allows a single temperature adjustment unit to control both the semiconductor package and interface board simultaneously, reducing temperature control time while maintaining uniform temperature distribution across both components.
Solution Approach 2:
The patent introduces a heat transfer member as an intermediary component between the push block and interface board. This heat transfer member enables thermal energy transfer from the push block to the interface board, allowing indirect temperature control of the interface board without requiring a separate temperature adjustment unit.
2Temperature
If separate temperature control means is provided for the interface board, then both semiconductor packages and interface board can be controlled independently, but the device complexity increases
Solution Approach 1:
The push block is designed to serve multiple functions: it acts as both a pressing mechanism for electrical contact and a temperature control component. By integrating the temperature adjustment unit with the push block and using the heat transfer member to extend thermal control to the interface board, the system achieves uniform temperature control of both components through a single integrated structure.
Solution Approach 2:
The patent combines the temperature control functions for both the semiconductor package and interface board into a single integrated system. The heat transfer member creates a thermal coupling that allows one temperature adjustment unit to control both components simultaneously, eliminating the need for separate temperature control means and reducing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise and rapid temperature control of semiconductor packages and interface boards, significantly reducing the time required for temperature adjustment and enhancing test reliability.
Implementation Method 1
a heat transfer member for thermally connecting the push block and the interface board
Data Source
AI summary
A semiconductor package test apparatus includes an interface board having connection terminals for electrically connecting a semiconductor package to a tester, a push block for pressing the semiconductor package toward the interface board to bring external terminals of the semiconductor package into contact with the connection terminals of the interface board, a temperature adjustment unit connected with the push block to heat or cool the semiconductor package to a test temperature through the push block, and a heat transfer member for thermally connecting the push block and the interface board.