Millimeter Wave RF Socket Absorber for ATE Testing
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Solution Overview
Problem
Current automatic testing equipment (ATE) for millimeter wave (mmW) packaged integrated circuits is unable to accurately measure RF parameters due to mismatches and high resistances introduced by standard spring-loaded pin sockets, leading to inaccurate measurements and increased costs for customized sockets, which are only suitable for low-volume testing.
Innovation Solution
The use of a mmW absorber adjacent to the output connector of the RF socket, along with modified sockets featuring cut-out areas in the elastomer and shield, improves matching and isolation, allowing for accurate RF signal transmission and concurrent testing of multiple mmW ICs, reducing cross-coupling and enabling higher accuracy in ATE measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If standard spring-loaded pin sockets are used for mmW testing, then the testing system is simple and low cost, but the RF signal transmission accuracy deteriorates due to mismatches and high resistances
Solution Approach 1:
The socket structure is modified by creating cut-out areas in the elastomer and shield at specific locations adjacent to RF signal carrying pins. This local modification improves RF signal transmission by reducing mismatches and resistances only where needed, without changing the entire socket structure, thus maintaining cost-effectiveness while enhancing measurement precision.
2Measurement precision
If customized high performance sockets are used to improve RF signal transmission, then measurement precision improves, but device complexity and cost increase
Solution Approach 1:
Instead of redesigning the entire socket structure, only specific local areas (adjacent to RF signal carrying pins) are modified with cut-outs in the elastomer and shield. This localized approach achieves high measurement precision while minimizing structural complexity and manufacturing cost.
Solution Approach 2:
The cut-out areas act as intermediaries between the RF signal carrying pins and the surrounding elastomer/shield structure. These openings allow RF signals to pass through with reduced interference, improving transmission accuracy without requiring a complete redesign of the socket architecture.
3Productivity
If multiple mmW ICs are tested concurrently to improve productivity, then testing efficiency increases, but cross-coupling between ICs increases causing measurement errors
Solution Approach 1:
The mmW absorber material positioned adjacent to the socket acts as an intermediary that absorbs RF signals and prevents cross-coupling between multiple ICs being tested concurrently. This allows accurate simultaneous testing of multiple devices without mutual interference.
Solution Approach 2:
The potential harmful effect of RF signal cross-coupling between adjacent ICs is converted into a benefit by strategically placing mmW absorber material. The absorber material captures the cross-coupling signals that would otherwise cause measurement errors, transforming the harmful interference into a controlled energy dissipation that improves measurement reliability during concurrent testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves better matching and isolation between RF ports, ensuring accurate RF measurements and enabling concurrent testing of multiple mmW ICs, thereby improving the reliability and efficiency of high-volume production testing while reducing costs.
Implementation Method 1
The use of a mmW absorber adjacent to the output connector of the RF socket, along with modified sockets featuring cut-out areas in the elastomer and shield, improves matching and isolation
Data Source
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AI summary
An ATE testing system (900, 1000) for millimetre wave (mmW) packaged integrated circuits (820) includes: at least one packaged integrated circuit (820); a radio frequency, RF, socket (700) configured to receive the at least one packaged integrated circuit (820) and facilitate routing RF signals thereto via at least one input connector and at least one output connector; and at least one interface configured to couple a tester to at least one packaged integrated circuit (820). The RF socket (700) includes a mmW absorber (1010) located adjacent the at least one output connector of the RF socket (700).