Semiconductor Probe Contact Body with Segmented Pressing Springs
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Solution Overview
Problem
Existing current applying devices for semiconductor inspection probes face issues with uneven contact with the inspection target body, leading to non-uniform current application and the need for full probe replacement due to abrasion of cone-shaped projections.
Innovation Solution
A current applying device with a separate contact body and pressing body, where the pressing body, composed of electrically-conductive elastic bodies, applies uniform pressure to the contact body, allowing for uniform contact with the inspection target body and enabling the contact body to be replaced independently, reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If square cone-shaped projections are used to contact the inspection target body, then the load can be distributed uniformly and abrasion of the gold plating layer can be delayed, but the projections touch the surface unevenly and cannot contact the surface uniformly
Solution Approach 1:
The contact body is divided into multiple independent pressing sections, each equipped with its own elastic body. This segmentation allows each section to independently adjust and apply pressure to the inspection target body, ensuring uniform contact across the entire surface while maintaining the load distribution benefits of the original cone-shaped design.
2Reliability
If the entire probe is replaced when the contact projections are abraded, then the device can maintain its functionality, but the cost increases due to replacement of the entire probe instead of just the contact body
Solution Approach 1:
The probe is segmented into a reusable main body and a replaceable contact body. The contact body, which contains the abrasion-prone elements, can be independently replaced without replacing the entire probe assembly, significantly reducing replacement costs while maintaining device functionality.
Solution Approach 2:
The contact body is designed as a consumable component with a limited service life due to abrasion. By making this specific component replaceable and relatively simple in structure, the system allows economical replacement of only the worn part rather than the entire expensive probe assembly.
3Device complexity
If a single contact body structure is used, then the device structure can be simplified, but the contact body cannot make uniform contact with the inspection target body surface
Solution Approach 1:
The contact body is divided into multiple independent pressing sections with individual elastic bodies. While this increases structural complexity compared to a single unified structure, it enables precise control over contact uniformity across the inspection target body surface, with each section independently adjusting to ensure even pressure distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures uniform current application to the inspection target body while allowing for the replacement of the contact body with a shorter lifespan, thereby reducing costs and maintaining probe stability.
Implementation Method 1
the pressing body includes a plurality of electrically-conductive elastic bodies which give pressing force to a plurality of sections of the contact body
Implementation Method 2
the pressing body electrifying the contact body while providing pressing force to each of a plurality of sections of the contact body
Data Source
AI summary
A current applying device is provided in which a contact body which surface-contacts with an inspection target body makes contact with the surface of the inspection target body uniformly; current can be favorably applied from the contact body to the inspection target body; and the contact body alone can be replaced. A probe device 1 for applying current by being in pressure-contact with the power semiconductor H includes: a contact body 2 which surface-contacts with the power semiconductor H; and a plurality of electrically-conductive two-tier springs 31 which press the contact body 2 onto the power semiconductor H; the contact body 2 and the plurality of electrically-conductive two-tier springs 31 are separate bodies, and the plurality of electrically-conductive two-tier springs 31 electrify the contact body 2 while providing pressing force F to each of a plurality of sections of the contact body 2.