Semiconductor Package Signal Speed Testing via Vertical Extension Board
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing signal speed test apparatuses for semiconductor packages require structural changes and replacement of components when testing different types of semiconductor packages, limiting their ability to test multiple packages on a single setup.
Innovation Solution
The apparatus includes a plurality of sockets with latches to fix semiconductor packages, multiple test boards with mount regions and extended test lines, and an extension board connected to a test head, allowing for signal speed testing without needing to change the socket or test board structure, and enabling testing of multiple semiconductor packages on multiple test boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the socket, insert, and guide are replaced with new components corresponding to each new semiconductor package, then the testing can be performed on different types of semiconductor packages, but the device complexity and time consumption increase due to frequent component replacement
Solution Approach 1:
The test board is designed with a universal interface that can accommodate multiple types of semiconductor packages simultaneously. The socket structure includes adjustable components that can adapt to different package types without requiring replacement of the entire socket assembly, allowing one socket to serve multiple functions for different package types.
Solution Approach 2:
The guide and insert components are designed with adjustable and movable features that can be reconfigured for different package types. The guide includes adjustable positioning elements that can be moved to different positions to accommodate various package dimensions, eliminating the need to replace rigid fixed components for each package type.
2Productivity
If the test head is arranged under the test board, then the signal speed test can be performed, but only semiconductor packages arranged on one test board can be tested at a time
Solution Approach 1:
Multiple test boards are arranged in a vertical stacked configuration rather than a single horizontal plane. The test head is positioned to access all test boards through the vertical arrangement, enabling simultaneous testing of packages on multiple test boards by utilizing the vertical dimension, thereby increasing productivity without proportionally increasing device complexity.
Data Source
AI summary
An apparatus for testing a signal speed of a semiconductor package may include a plurality of sockets, one or more test boards including at least a first test board, an extension board and a test head. Each of the sockets may be configured to receive the semiconductor package. The first test board may include a plurality of mount regions on which the sockets may be mounted, and test lines extended from the mount regions toward at least one side surface of the first test board. The extension board may be vertically arranged at the side surface of the first test board. The extension board may be electrically connected to the test lines. The test head may be electrically connected to the extension board to provide the mount regions with a test signal for testing the signal speed of the semiconductor package through the extension board. Thus, it may not be required to change a structure of the socket in accordance with types of the semiconductor packages.