Direct Transfer Apparatus for Semiconductor Die Alignment
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Solution Overview
Problem
Conventional semiconductor device transfer processes lack control over transfer parameters such as speed and vibration, leading to inefficiencies and increased costs due to the need for packaging, which results in larger, thicker devices and reduced manufacturing speed.
Innovation Solution
A direct transfer apparatus and method that aligns and transfers unpackaged semiconductor die from a wafer tape to a support substrate using a system of conveyance mechanisms, needles, and a fixing mechanism, allowing precise alignment and adhesion control to reduce device thickness and manufacturing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging process is used to protect semiconductor die, then device reliability is improved, but device thickness and volume increase significantly
Solution Approach 1:
The patent extracts the protective packaging from the final device structure and replaces it with a transfer apparatus that provides protection only during the transfer process. The die are transferred unpackaged directly to the substrate, eliminating the need for traditional protective packaging that increases device volume.
Solution Approach 2:
The transfer apparatus performs preliminary protection and handling of the die during the transfer process itself, rather than relying on post-transfer packaging. The controlled transfer environment and apparatus provide the necessary protection during movement, eliminating the need for additional protective packaging layers.
2Productivity
If high speed transfer process is used to increase productivity, then manufacturing speed is improved, but vibrations are generated that affect transfer quality
Solution Approach 1:
The transfer apparatus uses dynamic control of the transfer speed and motion profiles to minimize vibrations while maintaining high productivity. The system adjusts transfer parameters in real-time to optimize the balance between speed and vibration control, rather than using fixed high-speed transfer.
Solution Approach 2:
The apparatus implements vibration damping and cushioning mechanisms before and during the transfer process to prevent vibrations from affecting transfer quality. The system prepares for and compensates for vibrational effects in advance, allowing high-speed transfer without quality degradation.
3Strength
If adhesive is used to couple die to substrate, then bond strength is improved, but transfer time increases due to peeling requirement
Solution Approach 1:
The apparatus applies adhesive in advance to the substrate before die placement, allowing the adhesive to begin bonding immediately upon die contact. This preliminary preparation eliminates the need for subsequent peeling and reapplication steps, reducing overall transfer time while maintaining bond strength.
Solution Approach 2:
The transfer process uses continuous adhesive application and bonding without interruption or peeling steps. The die are transferred directly to the adhesive-coated substrate and bonded in a single continuous action, eliminating time losses associated with adhesive peeling and reapplication.
Data Source
AI summary
An apparatus includes a transfer mechanism to transfer an electrically-actuatable element directly from a wafer tape to a transfer location on a circuit trace on a product substrate. The transfer mechanism includes one or more transfer wires. Two or more stabilizers disposed on either side of the one or more transfer wires. A needle actuator is connected to the one or more transfer wires and the two or more stabilizers to move the one or more transfer wires and the two or more stabilizers to a die transfer position.