Semiconductor/Solid-State Device Details TRIZ Cases
- Integrated Fan-Out Package With Uplifted Die Attach Film
Uplifted die attach film edges encapsulate integrated circuit terminals, reducing delamination risks and improving routability in compact fan-out packages.
- Selective Blocking Boundary Placement for Electromigration Reliability
Selective recessing of copper interconnects creates self-aligned conducting caps to enhance electromigration resistance.
- Pressing Structure With Overlapping Spring Centers For Uniform Pressure
Alternating spring members with overlapping centers distribute elastic force, resolving non-uniform pressure concentration in pressing structures.
- Semiconductor Substrate Trench Stress Management for Bow Height Control
Trenches with specific depth ratios and stress layers reduce bow height to ensure uniform film deposition.
- Intermixed Capacitor Array for Matching Variation Reduction
Spatially intermixing parallel capacitor units minimizes area while reducing local and global capacitance variations to improve product performance uniformity.
- Direct Transfer Apparatus for Semiconductor Die Alignment
A direct transfer apparatus aligns unpackaged semiconductor die using conveyance mechanisms and needles.
- Active Tiling Placement for Latch-Up Immunity in CMOS SoC
Active tiles connect to supply voltages to reduce voltage drop and improve latch-up immunity in scaled CMOS designs.
- Cooler Metal Member Air Bubble Capture
A cooler metal member partitions refrigerant flow to capture air bubbles, preventing pump cavitation and vibration.
- Chamfered Corners in Component-Built Wiring Boards
Aligned chamfered corners at housing and component interfaces disperse thermal stress, preventing cracks in the resin filler.
- Dummy Terminal Inclined Extremity for Power Module Dielectric Strength
Shaped dummy terminal extremity eliminates sharp edges and reduces electric field concentration, improving dielectric strength without adding insulators.
- Wafer Level Cantilever Pillar Structure for Board Reliability
Segmented solder connections on vertical pillars distribute strain to resolve board level reliability issues caused by wafer warpage and voids.
- Flip-Chip Leadframe Plating to Prevent Solder Spreading
Oxide layers around plated leadframe areas laterally constrain solder spread, preventing voids in molding compound.
- Vertical Semiconductor Device Contact Plug Alignment
A vertical semiconductor device uses an insulating interlayer pattern to align contact plugs with word line edges.
- Contoured Package-on-Package Joint for Reduced Thickness
A contoured mounting stud with a hemispherical surface enhances contact area and prevents solder deformation in package-on-package assemblies.
- IGBT Guard Ring Mesa Structure for Carrier Control
Removing the collector layer beneath the guard ring creates a mesa structure that prevents carrier accumulation and reduces electric field concentration.
- Narrowed Interconnect Features via Mandrel Extraction
Mandrel extraction and spacer formation enable precise fuse programming without complex lithography.
- Semiconductor Lead Frame Mold Resin Recess Design
Localized mold resin recesses expose minimal lead frame areas for connections, preventing moisture ingress and enhancing device reliability.
- Conductive Line Protection Layer Prevents Etching Undercut
A tin protection layer prevents undercut in conductive lines, eliminating sidewall erosion and reducing cycle time compared to electroplating.
- Wettable Flank Lead Frames for Robust QFN Bonding
Segmented lead frames with etched fillets resolve structural rigidity issues in QFN packages, ensuring reliable bond adhesion under stress.
- Amplifier Drain Bonding Wires with Asymmetric Loop Heights
Asymmetric drain bonding wires distribute current across an amplifier package to prevent wire melting.
- Stacked Package Warpage Control via Balanced Metal Distribution
A stacked package structure uses balanced metal distribution across opposite surfaces to stabilize the device geometry during thermal processing.
- Semiconductor Structure Heat-Conducting Layer Thermal Management
A first heat-conducting layer passes through insulation and semiconductor layers to move thermal energy away from transistor regions.
- 3D Stacked Semiconductor Memory Wiring Lines
Stacked wiring lines with extended portions traverse interval regions between cell arrays in a three-dimensional semiconductor memory device.
- Semiconductor Module Temperature Sensor Placement
A semiconductor module integrates a temperature sensor on a metal wiring board above the active element.
- Through-Silicon Via Insulation Segmentation
A through-silicon via fabrication method using annular grooves and bottom films for electrical isolation.
- Embedded Die Substrate Segmentation for Yield and Warpage Control
Segmenting substrates into laminated layers allows testing defective components early, reducing material wastage while minimizing warpage in SiP modules.
- Plated Pillar Dies with Die-Level EMI Shield Layers
Die-level EMI shield layers form from metallic seed layers, reducing electromagnetic interference in sensitive regions without adding package complexity.
- Stacked Semiconductor Package with Interposer Leads
Interposer leads provide electrical connections between stacked chips, reducing device size while maintaining reliable manufacturing precision.
- Self-Aligned Via Integration with Sacrificial Blocks
Sacrificial blocks define self-aligned vias between conductive lines, eliminating overlay errors and reducing contact resistance in BEOL interconnects.
- GaN Buffer Layer Doping for Current Collapse
A semiconductor buffer layer uses transition metal doping to capture background electrons and reduce leakage current.
- Antioxidant-Doped Conductive Pillars for Warpage-Free Semiconductor Packages
Doping conductive pillars with antioxidants suppresses stannic oxide formation to enable direct attachment without reflow.
- Compliant Fasteners for Thermal Stress Relief in Electronic Assemblies
Spring-loaded fasteners accommodate thermal expansion mismatches between heatsinks and substrates, preventing cracking from excessive clamping forces.
- Protective Layer Composition for Printed Electronic Device Yield
Curable amine modified polyester and clay mineral composition protects electrode traces, increasing device yield by reducing fabrication damage.
- Non-Photoreactive IR Blocking Layer for Semiconductor Devices
A non-photoreactive infrared blocking layer conforms to semiconductor topography using a single photo-lithography step.
- Coreless IC Packaging Substrate with Embedded Conductive Studs
A coreless substrate embeds conductive studs within encapsulation layers to support integrated circuit devices.
- Solder Reflow Oven With Rotating Spindle and Lamp Heating
A solder reflow oven uses a rotating spindle and lamp assembly to heat substrates uniformly.
- Flexible Board Ductile Metal Interlayer Stress Relief
A flexible board employs a ductile metal interlayer between resin and conductor layers to absorb stress, preventing disconnection in multilayered structures.
- Superheated Steam Cleaning for Semiconductor Interconnection Structures
Superheated steam removes fluorine residues from interconnection openings, preventing barrier metal oxidation and maintaining low dielectric constants.
- Cu Wiring Adhesion in Wide Bandgap Semiconductor Devices
NH3 atmosphere reduction and heating remove oxide films from the Cu wiring electrode to prevent peeling of the diffusion prevention film at high temperatures.
- Light Emitting Device Phosphor Cover Reflection Frame
Segmented phosphor resin and extraction of reflection frame resolve joining stability versus production efficiency contradiction.
- Inclined Sidewall Memory Strings for Reduced Gate Leakage
Inclined sidewall memory strings reduce gate leakage and enhance data retention by minimizing charge diffusion in non-volatile semiconductor storage devices.
- Crack Stop Trenches in BEOL Layers for Low-k Dielectric Reliability
Etching crack stop trenches around cell regions isolates low-k dielectric layers to prevent delamination during semiconductor chip dicing.
- Integrated Circuit Packaging With Conductive Posts
Conductive posts embedded in underfill material increase interconnection density while maintaining joint strength for smaller packages.
- Semiconductor Bonding Pad Via Arrangement for Crack Prevention
Strategic via placement in bonding pads prevents stress-induced cracks in interlayer insulation films during wire bonding while maintaining electrode adhesion.
- Self-Aligned Dielectric Spacer Liner for Contact Via Alignment
A planar dielectric spacer liner with aligned openings guides interconnect via formation through a two-step anisotropic etching process.
- Semiconductor Package Structure with Conductive Shielding for EMI Reduction
Sandwiched conductive shielding structure surrounds semiconductor chips within a redistribution layer to provide electromagnetic interference protection.
- Semiconductor Package With Wettable Side Wall Bonding Pads
Side wall bonding pads allow solder immersion to shorten signal conduction distance and reduce parasitic inductance.
- ULK Metallization Via Layers for Chip-Package Interaction
Non-porous dielectric via layers embedded in ultra low-K metallization stacks resist thermal mismatch stress during lead-free reflow processes.
- Semiconductor Multilayer Wiring with Copper and Aluminum Interconnects
A semiconductor device structure using copper wiring connected to aluminum pads via a barrier film.
- Carrier Wafer Antireflective Coating for Laser Debonding
Multiple antireflective coating layers on a carrier wafer absorb infrared radiation to enable lower-power laser ablation debonding.