Semiconductor Package Structure with Conductive Shielding for EMI Reduction
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving compactness and reliability, particularly in integrated fan-out packages, where efficient routing and electromagnetic interference (EMI) shielding are crucial for future electronic devices.
Innovation Solution
A method of fabricating a package structure involving a carrier with a debonding layer and dielectric layer, where semiconductor chips are sandwiched between conductive plates and a redistribution layer, with a conductive shielding structure surrounding the chips to provide EMI shielding, and the package is processed to expose conductive pillars for connection, allowing for closer chip placement and reduced package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional packaging methods are used, then manufacturing simplicity is maintained, but package size and routing complexity increase
Solution Approach 1:
The patent transitions from traditional two-dimensional chip arrangement to three-dimensional integrated fan-out packaging, stacking multiple semiconductor chips vertically and routing signals through multiple layers. This dimensional change enables closer chip placement while providing multiple routing paths, thereby reducing package size without increasing routing complexity.
Solution Approach 2:
The packaging structure is divided into multiple functional layers including substrate, encapsulant, conductive shielding structures, and redistribution layers. Each layer performs specific functions (mechanical support, protection, EMI shielding, signal routing), allowing complex routing to be distributed across segments rather than concentrated in a single plane, thus reducing overall package size while maintaining routing simplicity.
2Object-affected harmful factors
If EMI shielding is added around semiconductor chips, then electromagnetic interference protection is improved, but manufacturing complexity increases
Solution Approach 1:
The conductive shielding structures are integrated with the encapsulant material during the same molding process, combining the EMI shielding function with the structural encapsulation function. This merging eliminates the need for separate shielding component fabrication and assembly, thereby improving EMI protection without significantly increasing manufacturing complexity.
Solution Approach 2:
The encapsulant material serves multiple functions: mechanical protection of chips, structural support for the package, and EMI shielding when formulated with conductive particles. This multi-functionality reduces the number of separate components needed, simplifying manufacturing while providing comprehensive EMI protection.
Data Source
AI summary
A package structure including at least one conductive plate, a redistribution layer, a first semiconductor chip, a conductive shielding structure and an insulating encapsulant is provided. The first semiconductor chip is sandwiched in between the at least one conductive plate and the redistribution layer, wherein the first semiconductor chip is disposed on the at least one conductive plate and electrically connected to the redistribution layer. The conductive shielding structure is sandwiched in between the at least one conductive plate and the redistribution layer, wherein the conductive shielding structure surrounds the first semiconductor chip and electrically connects the at least one conductive plate with the redistribution layer. The insulating encapsulant is disposed on the redistribution layer, encapsulating the first semiconductor chip, the conductive shielding structure, and surrounding the at least one conductive plate.