Semiconductor Module Temperature Sensor Placement

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Solution Overview

Problem

Existing semiconductor modules face challenges in accurately detecting the temperature of semiconductor elements due to isolated placement of temperature sensors, which affects sensing accuracy and reduces the active area of the semiconductor element, thereby impacting performance.

Innovation Solution

A semiconductor module design featuring a laminated substrate with a metal wiring board on top of the semiconductor element, where a temperature sensor is placed on the metal wiring board, and a heat blocking part is incorporated to prevent heat diffusion, ensuring accurate temperature detection without compromising the semiconductor element's performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the temperature sensor is disposed on the copper circuits independent from the semiconductor element, then the arrangement flexibility is improved, but the temperature detection accuracy deteriorates because the thermistor cannot directly catch the heat of the semiconductor element

Engineering Contradiction:

Improvearrangement flexibilityVSAvoidtemperature detection accuracy

Core Design Contradiction:

Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

The patent introduces a thermistor mounting electrode as an intermediary component that directly contacts the semiconductor element. This electrode serves as a thermal mediator, conducting heat from the semiconductor element to the temperature sensor (thermistor) mounted on it. This resolves the contradiction by enabling direct heat transfer while maintaining arrangement flexibility through the electrode's integration into the circuit board structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Measurement precision

If the temperature sensor is attached directly on the semiconductor element, then the temperature detection accuracy is improved, but the active area of the semiconductor element is decreased

Engineering Contradiction:

Improvetemperature detection accuracyVSAvoidactive area of semiconductor element

Core Design Contradiction:

Measurement precisionVSArea of moving object

Solution Approach 1:

The patent segments the temperature sensing function from the semiconductor element itself by mounting the thermistor on a separate electrode structure. The semiconductor element maintains its full active area for electrical functions, while the thermistor mounting electrode provides a dedicated thermal contact area. This segmentation allows both high temperature detection accuracy and preservation of semiconductor active area.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from a two-dimensional planar arrangement where the thermistor would occupy space on the semiconductor element surface to a three-dimensional structure where the thermistor is mounted on a protruding electrode. This dimensional change allows the temperature sensor to be positioned in spatial proximity to the semiconductor element without occupying its active area, resolving the area loss problem while maintaining detection accuracy.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If the semiconductor element and the thermistor are disposed on the same base plate, then the manufacturing simplicity is improved, but the arrangement flexibility of circuit boards is restricted

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidarrangement flexibility of circuit boards

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent creates a universal thermistor mounting electrode structure that can be integrated into various circuit board designs and configurations. The electrode serves multiple functions: providing thermal contact, electrical connection, and mechanical mounting support. This multi-functional design maintains manufacturing simplicity while enabling flexible arrangement of circuit boards, as the electrode can be adapted to different layouts without requiring a fixed base plate configuration.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances temperature detection accuracy by allowing direct heat transfer from the semiconductor element to the sensor while maintaining the active area and performance of the semiconductor element.

Implementation Method 1

the metal wiring board includes a heat blocking part that blocks heat of the semiconductor element

Methodology Applied

Scientific EffectHeat blocking: Thermal Insulation

Implementation Method 2

a temperature sensor that detects a temperature of the semiconductor element

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS11239131B2Semiconductor module

Publication Date: 2022.02.01 FUJI ELECTRIC CO LTD

AI summary

A semiconductor module, including a laminated substrate that has an insulating plate, a circuit board disposed on a top surface of the insulating plate, and a heat dissipation plate disposed on a bottom surface of the insulating plate. The semiconductor module further has a semiconductor element disposed on a top surface of the circuit board, a metal wiring board disposed on a top surface of the semiconductor element, and a temperature sensor that detects a temperature of the semiconductor element, and that is disposed on a top surface of the metal wiring board. The metal wiring board includes a heat blocking part that blocks heat of the semiconductor element.