Semiconductor Package With Wettable Side Wall Bonding Pads
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges such as high signal loss and delay due to extended transmission distances and parasitic inductance, limited miniaturization, and difficulty in assessing solder joint reliability, especially in vertical mounting scenarios and multi-directional signal transmission requirements.
Innovation Solution
A package structure with a wettable side surface and a manufacturing method that includes side wall bonding pads for solder immersion, eliminating the need for bonding wires or metal bumps, allowing for reduced package size and shortened signal conduction distance, and enabling vertical mounting and multi-directional signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional wire bonding or metal bump packaging is used, then electrical connections can be established, but the package size increases and signal conduction distance extends leading to high loss and delay
Solution Approach 1:
The patent moves bonding pads from the traditional bottom surface to the side walls of the package, utilizing the vertical dimension. This allows signals to be transmitted through shorter paths via side wall bonding pads and conductive posts, reducing conduction distance and associated losses while maintaining compact packaging dimensions.
Solution Approach 2:
Instead of the conventional approach where bonding pads are located at the bottom and signals travel upward through wire bonds or metal bumps, this patent inverts the structure by placing bonding pads on the side walls and having conductive posts extend upward to connect with chip pins, thereby shortening the signal path.
2Adaptability or versatility
If bonding pads are located at the bottom of the package, then surface mounting is enabled, but vertical mounting and multi-directional signal transmission are not possible
Solution Approach 1:
The side wall bonding pad structure serves multiple functions: it enables both surface mounting and vertical mounting configurations, supports multi-directional signal transmission, and allows for flexible PCB layout designs. The same package structure can be adapted to different mounting requirements without redesign.
3Quantity of substance
If the number of I/Os is increased to meet packaging requirements, then more electrical contacts are needed, but the package area becomes limited
Solution Approach 1:
By transitioning from a two-dimensional bottom surface arrangement to a three-dimensional side wall configuration, the patent significantly increases the available area for bonding pads. The vertical side walls provide additional space to accommodate more electrical contacts without increasing the package footprint.
4Measurement precision
If solder joints are located at the bottom, then assembly is straightforward, but automatic optical inspection of solder quality becomes difficult
Solution Approach 1:
The side wall bonding pads provide a laterally accessible surface that reflects light well for optical inspection. The lateral positioning allows automatic optical inspection devices to clearly view the solder joints without being obscured by the package structure, enabling precise quality assessment while maintaining simple assembly procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability of electronic products by allowing for automatic inspection of solder quality, reduces package size, minimizes signal loss and delay, and meets the requirements for vehicle regulations and multi-directional signal transmission.
Implementation Method 1
first side wall bonding pads that can be immersed with solder are provided
Implementation Method 2
the solder wettability condition of the first side wall bonding pads can be checked
Data Source
AI summary
A package structure with a wettable side surface and a manufacturing method thereof, and a vertical package module are disclosed. The package structure includes a first dielectric layer, a chip and a circuit layer. The first dielectric layer is provided with a package cavity, side wall bonding pads are arranged on a side wall of the first dielectric layer and located outside the package cavity. The chip is packaged inside the package cavity, pins of the chip face first surface of the first dielectric layer. The circuit layer is arranged on the first surface of the first dielectric layer, and the circuit layer is directly or indirectly connected to the side wall bonding pads and the pins of the chip.