Direct Write Electronic Assemblies with Fabricated Foils
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Solution Overview
Problem
Existing direct write technologies for electronic assembly fabrication are limited to two-dimensional structures and lack bulk conductivity due to residual porosity and require post-processing for improved electrical properties, making the creation of efficient and cost-effective electronic assemblies challenging.
Innovation Solution
The method involves producing a metal foil substrate through etching or micro-machining and using direct write manufacturing to deposit conductive materials both within and out of the plane defined by the foil, enabling the creation of complex electronic assemblies with enhanced conductivity by combining direct write technologies with prefabricated metal foils.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If direct write technology is used to print electronic structures, then manufacturing flexibility and customization are improved, but the structures are limited to two dimensions and lack bulk conductivity due to residual porosity
Solution Approach 1:
The electronic assembly is divided into multiple foils with different functional layers. Each foil can be manufactured using appropriate processes (etching, micro-machining, or direct write) and then assembled together. This segmentation allows each layer to contribute specific properties while the composite structure achieves three-dimensional functionality and bulk conductivity.
Solution Approach 2:
The patent combines multiple materials and manufacturing techniques to create a composite electronic assembly. Metal foils produced by etching or micro-machining provide bulk conductivity, while direct write printed structures add functional elements. The combination of these different materials and structures resolves the contradiction between manufacturing flexibility and conductivity quality.
2Ease of manufacture
If conductive inks are used to create entire electronic structures, then manufacturing simplicity is improved, but production efficiency and cost-effectiveness deteriorate
Solution Approach 1:
The electronic assembly is divided into multiple foils with different functional layers. Each foil can be manufactured using appropriate processes (etching, micro-machining, or direct write) and then assembled together. This segmentation allows each layer to contribute specific properties while the composite structure achieves three-dimensional functionality and bulk conductivity.
Solution Approach 2:
Instead of printing the entire electronic structure with conductive ink, the patent applies direct write technology only to specific functional elements where customization is needed, while other structures are formed by etching or micro-machining metal foils. This partial application of printing reduces production time and cost while maintaining manufacturing flexibility for critical components.
3Ease of manufacture
If printed structures are used, then manufacturing simplicity is improved, but post-processing requirements increase to densify structures and improve electrical properties
Solution Approach 1:
The electronic assembly is divided into multiple foils with different functional layers. Each foil can be manufactured using appropriate processes (etching, micro-machining, or direct write) and then assembled together. This segmentation allows each layer to contribute specific properties while the composite structure achieves three-dimensional functionality and bulk conductivity.
Solution Approach 2:
The patent changes the physical state and properties of materials through controlled processing. Metal foils are etched or micro-machined to create conductive pathways with inherent bulk properties, reducing the need for post-processing densification. The combination of different manufacturing parameters across multiple layers achieves the desired electrical properties without extensive post-processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the efficient and cost-effective production of customizable, three-dimensional electronic assemblies with improved electrical properties, facilitating electronic communication between foils and reducing the need for extensive post-processing.
Implementation Method 1
producing a first foil from a metal substrate by an etching process or micro-machining process
Implementation Method 2
writing a first structure by depositing conductive material via a direct write manufacturing process to the first foil
Data Source
AI summary
Method for manufacturing an electronic component is provided. The method includes manufacturing elements that are produced by an additive manufacturing process. Moreover, the elements are produced in the same plane or out of plain with one or more foil substrates. The elements may be various structures, including, for example, connectors, electrical components (e.g., a resistor, a capacitor, a switch, and/or the like), and/or any other suitable electrical elements and/or structures.